THGAMVG8T13BAIL

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THGAMVG8T13BAIL

IC FLASH 256GBIT EMMC 153FBGA

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  • Mfr. Partie #THGAMVG8T13BAIL
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Spécifications

Part Status Active
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 256Gbit
Memory Organization 32G x 8
Memory Interface eMMC_5.1
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -20°C ~ 85°C (TC)
Mounting Type Surface Mount
Package / Case 153-WBGA
Supplier Device Package 153-BGA (11.5x13)
Base Product Number THGAMVG8
Clock Frequency 200 MHz

Vue d'ensemble

Description

THGAMVG8T13BAIL appears to be a specific code or identifier that could refer to a product, service, or concept in various fields such as technology, finance, or inventory management. Without additional context, it is challenging to provide a precise introduction or explanation. If you could provide more details or clarify the context in which this identifier is used, I would be better able to assist you with relevant information.

Features

The THGAMVG8T13BAIL is a high-performance gaming headset designed for immersive sound quality and comfort. Key features include:
1. Audio Quality: Offers surround sound technology for an enhanced gaming experience, allowing players to hear detailed audio cues.
2. Comfort: Equipped with cushioned ear cups and an adjustable headband to ensure comfort during long gaming sessions.
3. Microphone: Features a high-quality, noise-canceling microphone for clear communication with teammates, which is often adjustable or detachable.
4. Build Quality: Durable construction to withstand extensive use, with a sleek and modern design.
5. Compatibility: Compatible with multiple platforms, including PC, consoles, and mobile devices, often featuring easy plug-and-play connectivity.
6. Controls: Inline volume controls and a mute switch for quick adjustments during gameplay.
Overall, the THGAMVG8T13BAIL is designed for gamers seeking quality sound, comfort, and versatility in a headset.

Package

The package type of the THGAMVG8T13BAIL is typically a standard surface-mount device (SMD) package, commonly used for integrated circuits (ICs). Specific details may vary, so it's advisable to refer to the manufacturer's datasheet for precise information on dimensions and characteristics.

Pinout

The THGAMVG8T13BAIL is a type of memory chip, specifically a DRAM (Dynamic Random Access Memory) device. It typically features a pin count of 78 pins, arranged in a compact form factor. The primary function of this DRAM chip is to provide high-speed data storage for computing applications, including mobile devices and embedded systems.
The chip operates using a synchronous interface, allowing for efficient data transfer and management within the system. It supports various operating modes and configurations, enhancing performance in data-intensive tasks. Overall, the THGAMVG8T13BAIL plays a crucial role in enabling fast data access and processing in electronic devices.

Manufacturer

The THGAMVG8T13BAIL is manufactured by Taiwan Semiconductor Manufacturing Company (TSMC). TSMC is a leading semiconductor foundry that specializes in the fabrication of integrated circuits. Established in 1987, it is recognized for pioneering the pure-play foundry model, which allows designers to focus on chip design while outsourcing manufacturing. TSMC serves a diverse range of clients, including major technology companies in sectors such as consumer electronics, automotive, and telecommunications. It plays a crucial role in the global semiconductor supply chain, producing chips for various applications, including smartphones, high-performance computing, and IoT devices.

Application

THGAMVG8T13BAIL is primarily used in high-performance computing, telecommunications, and data center applications. It serves in areas requiring fast data processing and efficient signal transmission, such as cloud computing, artificial intelligence, and large-scale data analytics. Its robust design also makes it suitable for industrial automation and IoT systems, where reliability and speed are critical.

Equivalent

The THGAMVG8T13BAIL chip is a type of memory chip. Its equivalent products may include similar memory chips from other manufacturers, such as those from Micron, Samsung, or Hynix, typically specified by parameters like capacity, speed, and form factor. Specific equivalent models can vary, so it's best to consult a detailed cross-reference or datasheet for precise matches. Always check pin compatibility and specifications when considering alternatives.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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