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TC58CVG1S3HRAIG
IC FLASH 2GBIT SPI 104MHZ 8WSON
- Fabricant
- Mfr. Partie #TC58CVG1S3HRAIG
- Paquet
- Fiche de données
- En stock9464
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Spécifications
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Memory Interface | SPI |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (6x8) |
| Base Product Number | TC58CVG1 |
| Clock Frequency | 104 MHz |
Vue d'ensemble
Description
The TC58CVG1S3HRAIG offers features like fast data read/write speeds and a compact form factor, making it ideal for space-constrained applications. It is designed to operate efficiently in a wide range of environmental conditions, which is crucial for industrial and automotive sectors.
Overall, the TC58CVG1S3HRAIG is a reliable choice for applications needing high-performance flash memory with a balance of speed, durability, and data integrity.
Features
1. Technology: Built using NAND flash technology, which is known for its high-density data storage capabilities.
2. Capacity: Typically available in various storage capacities, suitable for different applications.
3. Interface: It commonly uses a parallel interface, which allows for efficient data transfer between the chip and the host device.
4. Performance: Offers reliable read and write speeds, making it suitable for consumer electronics, industrial applications, and other devices requiring robust storage solutions.
5. Data Retention and Endurance: Designed for high data retention and endurance, suitable for devices with frequent read/write cycles.
6. Applications: Used in a wide range of products, including smartphones, tablets, SSDs, and embedded systems.
7. Package Type: Typically comes in a compact package form factor, such as TSOP (Thin Small Outline Package), to save space in device designs.
These features make the TC58CVG1S3HRAIG a versatile choice for high-density, reliable storage needs.
Package
Pinout
The pin configuration includes power supply pins, ground pins, data I/Os, command, and control pins which are essential for interfacing with the device. The pins are used for operations such as read, write, and erase, as well as for managing the chip select and control signals like ALE (Address Latch Enable), CLE (Command Latch Enable), RE# (Read Enable), WE# (Write Enable), and others necessary for the NAND flash operation. Detailed functionality and pin assignments can be found in the technical datasheet provided by the manufacturer.
Manufacturer
Application
Equivalent
1. Samsung: K9F1G08U0F
2. Micron: MT29F1G08ABADAWP
3. SK Hynix: H27U1G8F2B
These alternatives should be verified for compatibility in terms of capacity, interface, and voltage to ensure they meet your specific application requirements.
Expédition
Méthodes d'expéditionNous
offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.
Référence des frais d'expédition (DHL/FedEx):
DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.
FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.
Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.
Paiements
Payment Methods
Le terme de paiement est 100% prépayé.
Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:
1. PayPal
2. Carte de crédit/débit
3. Transfert bancaire
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