SIS434DN-T1-GE3

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SIS434DN-T1-GE3

MOSFET N-CH 40V 35A PPAK 1212-8

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Spécifications

Package Tape & Reel (TR),Cut Tape (CT)
Series TrenchFET®
ProductStatus Active
FETType N-Channel
Technology MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss) 40 V
Current-ContinuousDrain(Id)@25°C 35A (Tc)
DriveVoltage(MaxRdsOnMinRdsOn) 4.5V, 10V
RdsOn(Max)@IdVgs 7.6mOhm @ 16.2A, 10V
Vgs(th)(Max)@Id 2.2V @ 250µA
GateCharge(Qg)(Max)@Vgs 40 nC @ 10 V
Vgs(Max) ±20V
InputCapacitance(Ciss)(Max)@Vds 1530 pF @ 20 V
PowerDissipation(Max) 3.8W (Ta), 52W (Tc)
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
SupplierDevicePackage PowerPAK® 1212-8

Vue d'ensemble

Description

The SIS434DN-T1-GE3 is a dual-band 802.11ac Wi-Fi module developed by SiS, designed for embedded systems and IoT applications. It supports both 2.4GHz and 5GHz frequency bands, enabling faster wireless communication and improved network performance. The module is characterized by its compact size, low power consumption, and ease of integration into various devices, making it suitable for applications in consumer electronics, industrial automation, and smart home technologies.
Key features include support for multiple authentication protocols, advanced security standards, and a range of data rates that enhance connection stability and speed. The SIS434DN-T1-GE3 is well-suited for applications requiring reliable Wi-Fi connectivity in diverse environments, including crowded spaces. Its design facilitates quick deployment and reduced time to market for developers looking to incorporate Wi-Fi capabilities into their products.

Features

The SIS434DN-T1-GE3 is a highly integrated dual-band Wi-Fi and Bluetooth combo chip designed for IoT applications. Key features include:
1. Dual-Band Support: Operates on both 2.4 GHz and 5 GHz frequencies, allowing for flexible connectivity and reduced interference.

2. Wi-Fi Standards: Supports Wi-Fi 802.11n, enabling high data rates and improved performance in crowded environments.
3. Bluetooth Connectivity: Integrates Bluetooth 4.2, providing low-energy wireless communication for smart devices.
4. Low Power Consumption: Designed for energy efficiency, making it suitable for battery-operated devices.
5. High Integration: Combines multiple functionalities in a single chip, reducing the need for additional components and simplifying design.
6. SPI, I2C, and UART Interfaces: Offers versatile communication options for seamless integration with other components.
7. Compact Package: Available in a small form factor, ideal for space-constrained applications.
This combination of features makes the SIS434DN-T1-GE3 suitable for applications in smart home devices, wearables, and other IoT solutions.

Package

The SIS434DN-T1-GE3 is packaged in a 32-pin QFN (Quad Flat No-lead) format. This package type is compact and allows for efficient thermal management and reduced footprint on printed circuit boards.

Pinout

The SIS434DN-T1-GE3 is a low-power, single-chip, dual-band (2.4 GHz and 5 GHz) WLAN (Wireless Local Area Network) solution designed for embedded systems. It features a pin count of 48 pins.
The key functions of the SIS434DN-T1-GE3 include:
1. Wireless Communication: Supports IEEE 802.11a/b/g/n standards for Wi-Fi connectivity.
2. Integrated MAC and Baseband: It incorporates both the MAC (Media Access Control) and baseband functions for efficient data processing.
3. Power Management: Offers various power-saving modes to optimize energy consumption in battery-powered devices.
4. Multiple Interface Support: Includes interfaces such as SPI, I2C, and UART for easy integration with microcontrollers and other devices.
5. Security Features: Supports WPA/WPA2 encryption for secure data transmission.
This device is commonly used in IoT applications, consumer electronics, and other wireless devices.

Manufacturer

The SIS434DN-T1-GE3 is manufactured by Vishay Intertechnology, Inc. Vishay is a global manufacturer of discrete semiconductors and passive electronic components. The company is known for its wide range of products, including diodes, resistors, capacitors, and integrated circuits, which are used in various applications across multiple industries such as automotive, industrial, consumer electronics, and telecommunications. Founded in 1962, Vishay has established itself as a key player in the electronics industry, focusing on innovation and quality in its component design and manufacturing processes.

Application

The SIS434DN-T1-GE3 is a dual-channel high-speed analog switch used in various applications, including telecommunication, consumer electronics, and data acquisition systems. It facilitates signal routing and analog switching for audio/video devices, communication equipment, and automated test systems. Its low on-resistance and fast switching capabilities make it suitable for precision signal processing and digital signal routing applications.

Equivalent

The SIS434DN-T1-GE3 chip, a single-chip CMOS RF transceiver, can have equivalent products such as the Nordic Semiconductor nRF24LE1, the Texas Instruments CC2500, and the Microchip MRF24J40. These alternatives provide comparable functionality for wireless communication in similar applications. Always verify specific requirements and compatibility before selecting a substitute.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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