S70FS01GSAGBHM213

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S70FS01GSAGBHM213

IC FLASH 1GBIT SPI/QUAD 24BGA

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  • Mfr. Partie #S70FS01GSAGBHM213
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Spécifications

Series FS-S
Part Status Active
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O
Voltage - Supply 1.7V ~ 2V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-BGA (8x6)
Base Product Number S70FS01
Clock Frequency 133 MHz
Grade Automotive
Qualification AEC-Q100

Vue d'ensemble

Description

The S70FS01GSAGBHM213 is a serial NOR Flash memory device designed for embedded applications. It offers a high-density storage solution with a capacity of 1 gigabit (128 megabytes). This device features a standard SPI (Serial Peripheral Interface) interface, enabling easy integration into microcontroller systems.
Key specifications include fast read speeds, low power consumption, and the ability to withstand numerous program/erase cycles, making it suitable for firmware storage and data retention in industrial, automotive, and consumer electronics. The S70FS01GSAGBHM213 also supports advanced features like security, including write protection and a unique ID for device identification, enhancing data integrity and reliability.
In summary, this Flash memory is ideal for applications requiring efficient data storage with quick access times and robust performance.

Features

The S70FS01GSAGBHM213 is a high-performance NAND Flash memory device designed for various storage applications. Key features include:
1. Capacity: 1GB storage capacity, ideal for embedded systems and portable devices.
2. Interface: Utilizes a Serial Peripheral Interface (SPI) for efficient data communication.
3. Speed: Offers fast read and write speeds, enhancing overall system performance.
4. Endurance: Designed for high endurance, suitable for applications requiring frequent write cycles.
5. Power Efficiency: Low power consumption, making it suitable for battery-operated devices.
6. Temperature Range: Operates reliably across a wide temperature range, ensuring stability in diverse environments.
7. Data Protection: Features built-in error correction and wear leveling to maintain data integrity and extend lifespan.
This combination of features makes the S70FS01GSAGBHM213 a versatile choice for consumer electronics, automotive applications, and industrial uses.

Package

The S70FS01GSAGBHM213 is packaged in a WLCSP (Wafer-Level Chip Scale Package) format. This type of packaging is compact and offers a small footprint, suitable for space-constrained applications while ensuring high performance and reliability.

Pinout

The S70FS01GSAGBHM213 is a 1 Gb (gigabit) NOR flash memory device from Cypress Semiconductor, now part of Infineon Technologies. It has a total pin count of 32 pins.
The main functions of the pins include:
- Data Pins (DQ0-DQ7): Used for data input and output.
- Address Pins (A0-A20): Used for addressing the memory locations.
- Chip Enable (CE): Activates the memory chip.
- Write Enable (WE): Controls write operations.
- Output Enable (OE): Controls output data flow.
- Reset (RESET): Resets the device.
- Ready/Busy (RB): Indicates the status of the memory operation.
- Vcc and Vss: Power supply and ground pins.
This device supports multiple features like fast read, write, and erase operations, making it suitable for various embedded applications.

Manufacturer

The S70FS01GSAGBHM213 is a product manufactured by Cypress Semiconductor Corporation, which is a part of Infineon Technologies AG as of 2020. Cypress specializes in advanced embedded solutions, particularly in semiconductor products and technologies for various applications, including automotive, industrial, and consumer electronics. The company is known for its Flash memory, microcontrollers, and connectivity solutions. Infineon, its parent company, is a leading global semiconductor manufacturer that focuses on automotive, industrial power control, and security technologies.

Application

The S70FS01GSAGBHM213 is a high-performance NAND flash memory device commonly used in applications such as consumer electronics, automotive systems, industrial automation, and telecommunications. Its features enable data storage for mobile devices, SSDs, embedded systems, and IoT applications, offering high speed, reliability, and durability for data-intensive tasks.

Equivalent

The S70FS01GSAGBHM213 chip is a 1 Gigabit Serial NOR Flash memory. Equivalent products may include the Micron MT25QL01GCBB8E, Winbond W25Q01JV, and the STMicroelectronics M25P10. These alternatives provide similar specifications, such as storage capacity and serial interface. Always verify compatibility based on specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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