S29GL256P11TFI020

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S29GL256P11TFI020

IC FLASH 256MBIT PARALLEL 56TSOP

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Spécifications

Series GL-P
Part Status Obsolete
Base Product Number S29GL256
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 32M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 110ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 56-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 56-TSOP
Packaging Tray
Access Time 110 ns

Vue d'ensemble

Description

The S29GL256P11TFI020 is a 256 Mbit (32 MB) NAND Flash memory chip manufactured by Silcon Storage Technology (SST). It is designed for a range of applications, including consumer electronics, automotive, and industrial systems. This memory device utilizes a single-level cell (SLC) architecture, which allows for enhanced reliability, endurance, and performance compared to multi-level cell (MLC) designs.
Key features include a serial peripheral interface (SPI) and a fast access time, supporting efficient read and write cycles. It offers a wide operating voltage range, making it suitable for various power-sensitive applications. The chip also includes built-in error correction code (ECC) capabilities to enhance data integrity.
The S29GL256P11TFI020 is characterized by its compact form factor and low power consumption, making it an ideal choice for portable devices. Overall, this NAND Flash memory solution provides a robust and efficient storage option for modern electronic applications.

Features

The S29GL256P11TFI020 is a 256 Mb (32 MB) NOR Flash memory device. Key features include:
1. Density: 256 Megabits (32 Megabytes).
2. Interface: Asynchronous, parallel interface.
3. Access Time: Typically 90 ns for read operations.
4. Voltage: Operates at 3.0V to 3.6V, with a low power mode for energy efficiency.
5. Endurance: Supports a high number of program/erase cycles, typically over 100,000 cycles per sector.
6. Data Retention: Retains data for a minimum of 20 years at 85°C.
7. Sector Architecture: Divided into multiple sectors (typically 64KB each) for flexible erase and programming.
8. Command Set: Supports a standard command set for read, program, and erase operations.
9. Compatibility: Designed for compatibility with industry-standard NOR Flash memory interfaces.
10. Security Features: Includes protection against accidental writes and erases.
This makes it suitable for a range of applications, including embedded systems, automotive, and consumer electronics.

Package

The S29GL256P11TFI020 is packaged in a TSOP (Thin Small Outline Package) with the dimensions of 40 pins. This package type is designed for easy integration onto printed circuit boards, optimizing space and allowing for efficient thermal performance.

Manufacturer

The manufacturer of the S29GL256P11TFI020 is Spansion LLC, a company that specializes in flash memory solutions. Spansion was formed as a joint venture between Advanced Micro Devices (AMD) and Fujitsu, focusing on NOR flash memory products used in a variety of applications, including automotive, consumer electronics, and industrial devices. The S29GL256P11TFI020 is a 256 Mb (megabit) NOR flash memory chip, known for its high performance and reliability in data storage. Spansion operates in the semiconductor industry, providing advanced memory solutions to meet the growing demand for memory in various electronic devices.

Application

The S29GL256P11TFI020 is a 256Mb NAND Flash memory device primarily used in embedded systems. Its application areas include automotive electronics, consumer electronics (like smartphones and tablets), industrial automation, networking equipment, and data storage solutions. It is suitable for firmware storage, code execution, and data logging in various devices requiring high-density, reliable non-volatile memory.

Equivalent

The S29GL256P11TFI020 is a 256 Mb (32 MB) NOR Flash memory chip. Equivalent products include the Micron MT29F256G08 and the Winbond W25N256JV. Other alternatives may include similar density chips from manufacturers like Spansion, Intel, or Samsung, provided they meet the same specifications (voltage, interface, timing, etc.). Always check compatibility for specific applications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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