S29GL01GP11FAIR10

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S29GL01GP11FAIR10

IC FLASH 1GBIT PARALLEL 64FBGA

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Spécifications

Series GL-P
Part Status Obsolete
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 110ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 64-LBGA
Supplier Device Package 64-FBGA (11x13)
Base Product Number S29GL01
Access Time 110 ns

Vue d'ensemble

Description

The S29GL01GP11FAIR10 is a type of flash memory produced by Spansion (now part of Cypress Semiconductor), primarily used in embedded systems for storage purposes. It features a 1 Gigabit (128 Megabytes) capacity and employs a uniform block architecture, allowing for efficient data management and flexibility in programming and erasing.
Key features include:
- Interface: Compatible with a standard parallel interface, facilitating easy integration into various electronic designs.
- Speed: Offers high-speed read and write operations, enhancing overall system performance.
- Endurance: Supports a substantial number of program/erase cycles, making it suitable for applications that require frequent data updates.
- Reliability: Designed with robust error correction capabilities, ensuring data integrity over time.
Applications include automotive systems, telecommunications, industrial automation, and consumer electronics, where non-volatile memory is essential for storing firmware, configuration data, and user information. The S29GL01GP11FAIR10 provides a reliable and efficient memory solution for diverse electronic applications.

Features

The S29GL01GP11FAIR10 is a high-density NOR Flash memory chip produced by Silicon Storage Technology (SST). Key features include:
1. Density: It offers 1 Gigabit (128 Megabytes) of memory capacity.
2. Interface: It uses a parallel interface for easy integration into various applications.
3. Speed: The chip supports fast read access times, typically around 60 ns, making it suitable for high-performance applications.
4. Endurance: It boasts a high program/erase endurance of up to 100,000 cycles, ensuring reliability over time.
5. Data Retention: The device guarantees data retention for up to 20 years under typical conditions.
6. Low Power Consumption: The chip is designed for low power operation, benefiting battery-operated devices.
7. Sector Architecture: It features a sector erase architecture, allowing individual sectors to be erased and reprogrammed without affecting the entire chip.
8. Compatibility: It is compatible with various standard protocols, making it versatile for applications in consumer electronics, automotive, and industrial sectors.
This combination of features makes the S29GL01GP11FAIR10 ideal for embedded systems requiring reliable, fast, and efficient non-volatile storage.

Package

The S29GL01GP11FAIR10 is packaged in a 32-pin TSOP (Thin Small Outline Package) format. This type of package is designed for surface mounting and is commonly used for flash memory devices.

Pinout

The S29GL01GP11FAIR10 is a 1-Gbit (128 MB) Flash memory device, specifically a NOR Flash type. It features a total of 48 pins in a TSOP (Thin Small Outline Package) configuration.
Key functions of the pins include:
1. Address Inputs (A0-A26): Used to select memory locations.
2. Data Inputs/Outputs (DQ0-DQ7): Bi-directional data bus for inputting and outputting data.
3. Chip Enable (CE): Activates the chip for read/write operations.
4. Output Enable (OE): Controls data output from the device.
5. Write Enable (WE): Enables write operations.
6. Ready/Busy (RY/BY): Indicates the status of the device (ready or busy).
7. Reset (RESET): Resets the memory device.
8. VCC: Power supply.
9. GND: Ground.
The S29GL01GP11FAIR10 is commonly used in various applications requiring non-volatile memory storage.

Manufacturer

The S29GL01GP11FAIR10 is manufactured by Spansion, a company known for its flash memory products. Spansion specializes in semiconductor technology, focusing on NAND and NOR flash memory solutions. It was formed through the merger of the memory divisions of AMD and Fujitsu, and it primarily serves the automotive, industrial, and consumer electronics markets. Spansion's products are widely used in applications that require reliable, high-performance memory solutions, such as mobile devices, embedded systems, and data storage. The company has been recognized for its innovations in memory technology and continues to be a significant player in the semiconductor industry.

Application

The S29GL01GP11FAIR10 is a 1 Gbit NOR Flash memory device primarily used in embedded systems. Its application areas include consumer electronics, automotive systems, industrial automation, networking equipment, and telecommunications. It is suitable for firmware storage, boot code, and data logging due to its high endurance and reliability.

Equivalent

The S29GL01GP11FAIR10 is a 1 Gb NOR Flash memory chip. Equivalent products include the Micron MT29F1G01ABAEAWP, Winbond W25N01GV, and Spansion S29GL01GS. Always check specific data sheets for compatibility and features, as there may be variations in performance and specifications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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