PC28F256P33BFE

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PC28F256P33BFE

IC FLASH 256MBIT PAR 64EASYBGA

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  • Mfr. Partie #PC28F256P33BFE
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Spécifications

Series Axcell™
Part Status Obsolete
Base Product Number PC28F256
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 16M x 16
Memory Interface Parallel
Clock Frequency 52 MHz
Write Cycle Time - Word, Page 95ns
Voltage - Supply 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC)
Mounting Type Surface Mount
Package 64-TBGA
Supplier Device Package 64-EasyBGA (8x10)
Packaging Tray
Access Time 95 ns

Vue d'ensemble

Description

The PC28F256P33BFE is a flash memory device produced by Intel as part of its NOR flash family. It has a capacity of 256 megabits (32 megabytes) and utilizes a 3.3V power supply, making it suitable for low-power applications. This memory type is organized in a x8 configuration, allowing for efficient data storage and retrieval.
The device features a range of functionalities, including dual-plane architecture, which enhances read and program performance, and a robust erase capability that allows sectors to be erased individually. It supports various programming modes, including byte and word programming, and offers a high number of program/erase cycles, typically around 100,000 cycles per sector.
Designed for use in consumer electronics, telecommunications, and embedded systems, the PC28F256P33BFE is ideal for applications requiring reliable non-volatile storage, such as firmware storage, code execution, and data logging. Its compatibility with common memory interfaces makes it easy to integrate into various hardware designs.

Features

The PC28F256P33BFE is a 256 Mb (32 MB) flash memory device from Intel, primarily designed for embedded applications. Key features include:
1. Architecture: NOR flash architecture, allowing for random access and fast read speeds.
2. Access Time: Typically offers access times of 33 ns, suitable for high-performance applications.
3. Endurance: Supports up to 1,000 program/erase cycles per sector, ensuring durability.
4. Data Retention: Features a data retention period of up to 20 years, making it reliable for long-term storage.
5. Organization: Organized as 32 M x 8 bits or 16 M x 16 bits, providing flexibility in data handling.
6. Interface: Utilizes a standard parallel interface, simplifying integration with microcontrollers.
7. Power Supply: Operates on a voltage range of 2.7V to 3.6V, catering to low-power applications.
8. Block Protection: Supports block protection features to secure critical data.
9. Programming Mode: Supports fast programming and erasing capabilities.
These features make the PC28F256P33BFE suitable for applications in telecommunications, automotive, and consumer electronics.

Package

The PC28F256P33BFE is typically packaged in a 48-lead TSOP (Thin Small Outline Package) format. This type of package is designed for surface mounting and is commonly used for memory devices like flash memory.

Pinout

The PC28F256P33BFE is a 256 Mb (32 MB) NOR Flash memory device from Intel's StrataFlash series. It typically has a pin count of 48 pins.
The primary functions of these pins include:
1. Address Inputs (A0-A20): Used to select memory locations.
2. Data Inputs/Outputs (DQ0-DQ15): 16-bit data bus for reading and writing data.
3. Chip Enable (CE#): Activates the chip for read or write operations.
4. Output Enable (OE#): Enables the output drivers to read data.
5. Write Enable (WE#): Controls the write operations.
6. Ready/Busy (RY/BY#): Indicates the status of memory operations.
7. Reset (RESET#): Resets the memory device.
8. VCC and Ground (GND): Power supply and ground connections.
This device is typically used in applications requiring non-volatile storage, such as embedded systems and firmware storage.

Manufacturer

The PC28F256P33BFE is manufactured by Intel Corporation. Intel is a multinational technology company based in the United States, primarily known for designing and manufacturing semiconductor products, including microprocessors, memory, and storage solutions. Founded in 1968, Intel is a key player in the computer hardware industry and has played a significant role in the development of modern computing technology. The company focuses on innovation and is involved in various sectors, including personal computing, data centers, artificial intelligence, and Internet of Things (IoT) devices. Intel is recognized for its contributions to the advancement of computing architecture and has a strong presence in both consumer and enterprise markets.

Application

The PC28F256P33BFE is a 256-Mbit NAND Flash memory device primarily used in applications such as consumer electronics, mobile phones, digital cameras, and automotive systems. It is suitable for data storage and retrieval in embedded systems, firmware storage, and as a boot memory in various electronic devices, enabling fast access and reliable data retention.

Equivalent

The equivalent products for the PC28F256P33BFE chip include the Intel StrataFlash products like the PC28F256P30B, as well as similar flash memory chips from manufacturers like Micron (MT28F256P30), and Winbond (W29C256). Always verify compatibility regarding voltage, interface, and specifications before substitution.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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