PAN2025B50X

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PAN2025B50X

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  • Mfr. Partie #PAN2025B50X
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  • Fiche de données
  • En stock29626

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Spécifications

Manufacturer JLCPCB Assembly
Package QFN32

Vue d'ensemble

Description

PAN2025B50X is a cutting-edge material that belongs to the family of polyacrylonitrile (PAN)-based carbon fibers, designed for advanced applications in aerospace, automotive, and energy sectors. It boasts a unique formulation that enhances its mechanical properties, thermal stability, and chemical resistance. The designation "B50X" suggests specific characteristics such as fiber diameter, tensile strength, and modulus, which are optimized for high-performance use.
This material is particularly noted for its lightweight nature and high strength-to-weight ratio, making it ideal for applications where reducing weight is crucial without compromising structural integrity. Additionally, PAN2025B50X is engineered to offer excellent processability, facilitating easy integration into various manufacturing processes, including weaving and composite molding.
Overall, PAN2025B50X represents a significant advancement in material science, promising to enhance the performance of composite materials in demanding environments.

Features

The PAN2025B50X is a compact and versatile Bluetooth module designed for various wireless applications. Key features include:
1. Bluetooth Version: Supports Bluetooth 5.0 for enhanced speed and range.
2. Low Power Consumption: Optimized for energy efficiency, making it ideal for battery-operated devices.
3. Small Form Factor: Miniature size allows easy integration into space-constrained designs.
4. High Data Rate: Capable of achieving high throughput, suitable for data-intensive applications.
5. Multiple Profiles: Supports various Bluetooth profiles, including BLE (Bluetooth Low Energy) for diverse connectivity options.
6. Integrated Antenna: Comes with a built-in antenna, simplifying the design process.
7. Wide Operating Range: Operates effectively in various environmental conditions.
8. Robust Security: Features advanced security protocols to protect data transmission.
These attributes make the PAN2025B50X suitable for IoT applications, wearables, and other wireless communication needs.

Package

The PAN2025B50X is a surface-mount package type, specifically designed for compact applications. It typically features a 50-pin configuration, allowing for efficient integration into various electronic devices.

Pinout

The PAN2025B50X is a Bluetooth module featuring a total of 25 pins. Its primary functions include facilitating Bluetooth communication, interfacing with microcontrollers, and providing various I/O capabilities. Key features include support for Bluetooth Classic and Bluetooth Low Energy (BLE), making it suitable for a range of wireless applications.
The pin configuration typically includes power supply pins (VCC, GND), UART communication pins (TX, RX), and additional pins for GPIO, antenna connection, and other functionality. The exact pin arrangement and detailed functions can vary, so it is advisable to consult the specific datasheet for the PAN2025B50X for complete information regarding pin assignments and functionalities.

Manufacturer

The PAN2025B50X is manufactured by Panasonic, a multinational electronics company headquartered in Osaka, Japan. Founded in 1918, Panasonic is recognized for its wide range of products, including consumer electronics, automotive systems, industrial solutions, and home appliances. The company is a leading player in the global electronics market, known for its innovation and commitment to sustainability. Panasonic focuses on developing advanced technologies and products to enhance everyday life and drive energy efficiency.

Application

The PAN2025B50X is a high-performance, low-power Bluetooth module used in various applications, including automotive systems, industrial automation, smart home devices, wearables, healthcare monitoring, and consumer electronics. Its capabilities make it suitable for seamless wireless communication, enabling IoT connectivity and enhancing user experiences in smart technology environments.

Equivalent

The PAN2025B50X chip is a Bluetooth module. Equivalent products include the RN-4870 from Microchip, the HC-05 and HC-06 from Jinan Huamao Technology, and the Nordic nRF52832. Depending on specific application requirements, variations may be found in features such as range, power consumption, and additional functionalities. Always verify compatibility and specifications before substitution.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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