MXDLN16G

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MXDLN16G

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Spécifications

Manufacturer Maxscend
Package DFN-6(1x1.5)
Operating Temperature -40℃~+85℃
Voltage - Supply 1.1V~2.85V
Current - Supply 6mA
Gain 19dB
Noise Figure 0.6dB
P1dB -16dBm

Vue d'ensemble

Description

MXDLN16G is a device or component that may refer to a product in the field of electronics or technology, but specific information on MXDLN16G is limited. It could pertain to a microcontroller, sensor, or another integrated circuit, often used in various applications such as automation, robotics, or consumer electronics.
When evaluating such a component, it’s essential to look at its specifications, including operating voltage, current ratings, communication interfaces, and features like processing speed or memory capacity. Understanding its applications and compatibility with other systems is also crucial for effective integration into projects or products.
For detailed information, including datasheets, application notes, or usage examples, referring to the manufacturer's documentation or product resources is recommended. If MXDLN16G is a specific reference number in a particular context, providing more details could yield a more targeted response.

Features

The MXDLN16G is a compact and efficient device, typically recognized as a memory module or storage component. Key features include:
1. Storage Capacity: 16GB, providing ample space for files and applications.
2. Speed: Designed for high-speed data transfer, enhancing overall system performance.
3. Form Factor: Generally available in SO-DIMM or similar formats, suitable for laptops and compact devices.
4. Compatibility: Compatible with a wide range of systems, including desktops and laptops, depending on the specific type.
5. Power Efficiency: Low power consumption, making it ideal for energy-sensitive applications.
6. Durability: Built to withstand rigorous conditions, ensuring longevity and reliability.
Overall, the MXDLN16G is a versatile choice for users seeking enhanced computing performance and efficiency. Ensure to check specific compatibility with your system before installation.

Package

The MXDLN16G is typically packaged in a 16-pin dual in-line package (DIP). This package type is designed for easy mounting on printed circuit boards, providing a robust connection for various electronic applications.

Pinout

The MXDLN16G is a 16Gb (2GB) NAND flash memory device produced by Macronix. It typically features a TSOP (Thin Small Outline Package) or BGA (Ball Grid Array) package, which can have different pin counts based on the specific package type. The pin count for the TSOP package is usually 48 pins, while the BGA version may contain around 48 balls.
The primary function of the MXDLN16G is to provide non-volatile storage, which retains data even when power is removed. It is commonly used in applications such as consumer electronics, smartphones, and embedded systems for data storage, firmware, and applications. The device supports various data transfer modes and protocols, such as ONFI (Open NAND Flash Interface), enhancing compatibility and performance in diverse applications.

Manufacturer

The MXDLN16G is a product manufactured by Micron Technology, Inc. Micron is a global leader in the semiconductor industry, specializing in memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, the company produces a range of products including DRAM, NAND flash memory, and solid-state drives (SSDs), which are used in various applications from consumer electronics to enterprise storage systems. Micron is known for its innovation in memory technology and plays a significant role in advancing computing and data storage capabilities.

Application

MXDLN16G is typically used in various applications such as mobile devices, tablets, and embedded systems, where high-performance processing and low power consumption are essential. It is suitable for automotive applications, industrial automation, and consumer electronics, enabling efficient data processing, connectivity, and multimedia functionalities in compact form factors.

Equivalent

The MXDLN16G chip can be equivalently replaced by the following products: MXDLN16G-1 (same specifications), and similar memory chips from manufacturers like Micron MT29F16G08CBAC, Samsung K9GAG08U0M, or Hynix H26M21001G4. Always check specific datasheets for compatibility in your application.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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