MX60LF8G18AC-XKI

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MX60LF8G18AC-XKI

IC FLASH 8GBIT PARALLEL 63VFBGA

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Spécifications

Series MX60LF
Part Status Not For New Designs
Base Product Number MX60LF8
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 8Gbit
Memory Organization 1G x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 20ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
Packaging Tray
Access Time 20 ns

Vue d'ensemble

Description

The MX60LF8G18AC-XKI is a high-performance, low-power mobile DRAM designed by Macronix International. This device features a density of 8 gigabits (1 GB) and is based on the DDR3 (Double Data Rate 3) technology, specifically optimized for applications requiring quick data access and efficient power consumption. It operates at a voltage of 1.5V, which is typical for DDR3, ensuring compatibility with a wide range of devices.
The MX60LF8G18AC-XKI is particularly suitable for mobile and embedded applications, including smartphones, tablets, and other portable devices, where memory speed and energy efficiency are critical. It supports various data rates and has a high bandwidth, facilitating faster data transfer rates essential for demanding applications. Its compact form factor and reliability make it an attractive choice for manufacturers looking to enhance device performance while managing power requirements effectively.

Features

The MX60LF8G18AC-XKI is a NAND flash memory chip from Macronix, specifically designed for high-density storage solutions. Key features include:
1. Capacity: 8 Gb (Gigabits), suitable for applications requiring significant memory storage.
2. Interface: It utilizes a parallel interface, making it compatible with various systems and enabling easy integration.
3. Technology: Built on advanced 1x nm process technology, optimizing performance and reducing power consumption.
4. Voltage: Operates on a typical voltage range of 2.7V to 3.6V, supporting low-power applications.
5. Read/Write Speed: Offers fast read and write speeds, enhancing data access and efficiency.
6. Endurance: Designed for high endurance with many program/erase cycles, making it suitable for demanding applications.
7. Applications: Commonly used in consumer electronics, automotive, industrial, and networking devices.
Overall, the MX60LF8G18AC-XKI is a reliable choice for applications needing robust and efficient flash memory solutions.

Package

The MX60LF8G18AC-XKI is packaged in a 48-ball FBGA (Fine Ball Grid Array) format. This package type is designed for compactness and efficient thermal management, making it suitable for mobile and embedded applications.

Pinout

The MX60LF8G18AC-XKI is a NAND flash memory chip from Macronix. It features a total of 48 pins. The main functions of these pins include power supply, ground, data input/output, command, and control signals necessary for the operation of the memory device. Specifically, it supports a parallel interface for communication with a host controller. Key pins include:
- VCC: Power supply
- GND: Ground
- DQ0-DQ7: Data input/output pins
- CLE: Command latch enable
- ALE: Address latch enable
- WE: Write enable
- RE: Read enable
- CE: Chip enable
These pins facilitate reading, writing, and erasing operations, allowing for integrated storage solutions in various applications.

Manufacturer

The MX60LF8G18AC-XKI is manufactured by Macronix International Co., Ltd. Macronix is a Taiwanese company that specializes in the design and production of non-volatile memory solutions, including NOR Flash and NAND Flash memory products. Founded in 1989, the company focuses on serving various markets such as consumer electronics, automotive, and industrial applications. Macronix is recognized for its commitment to innovation and quality in semiconductor technology, providing reliable memory solutions for a diverse range of applications.

Application

The MX60LF8G18AC-XKI is a NAND flash memory chip primarily used in applications such as mobile devices, consumer electronics, automotive systems, and industrial equipment. Its high density and reliability make it suitable for data storage in smartphones, tablets, and wearables, as well as in embedded systems and IoT devices. Additionally, it supports tasks requiring fast read/write speeds and durability in various operating environments.

Equivalent

The MX60LF8G18AC-XKI is a NAND flash memory chip. Equivalent products include the Micron MT29F8G08ABAEAWP, Samsung K9GAG08U0M, and Toshiba TH58NVG8D2FLA. When considering alternatives, ensure compatibility with the specific application in terms of pin configuration, voltage, and memory architecture. Always check the manufacturer's datasheets for detailed specifications before replacement.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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