MX30UF2G18AC-XKI

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MX30UF2G18AC-XKI

IC FLASH 2GBIT PARALLEL 63VFBGA

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  • Mfr. Partie #MX30UF2G18AC-XKI
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  • En stock5652

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Spécifications

Series MX30UF
Part Status Not For New Designs
Base Product Number MX30UF2
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 25ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
Packaging Tray
Access Time 25 ns

Vue d'ensemble

Description

The MX30UF2G18AC-XKI is a 2-gigabit (Gb) 3D NAND flash memory device produced by Macronix. It is designed for a variety of applications, including mobile devices, consumer electronics, and automotive systems. The device features a high-performance interface, supporting both ONFI (Open NAND Flash Interface) and Toggle mode, which allows for faster data transfer rates and improved efficiency.
Key characteristics include low power consumption, making it suitable for battery-operated devices, and a robust architecture that enhances reliability and endurance. The 3D NAND technology enables higher storage density and better performance compared to traditional 2D NAND flash. This device is ideal for applications requiring high-speed data access and durable storage solutions.
Overall, the MX30UF2G18AC-XKI combines advanced technology with flexibility, catering to various market needs in a compact form factor.

Features

The MX30UF2G18AC-XKI is a 2-Gb (256M x 8) NOR Flash memory device from Macronix. Key features include:
1. Density: 2 Gb (256 MB).
2. Voltage: Operates at a supply voltage of 2.7V to 3.6V.
3. Interface: Supports SPI (Serial Peripheral Interface) for easy integration with microcontrollers and processors.
4. Speed: Offers fast read speeds, typically around 104 MHz for optimal performance.
5. Architecture: Dual and Quad I/O functionality for enhanced data transfer rates.
6. Endurance: Supports a high number of program/erase cycles, typically around 100,000 cycles.
7. Data Retention: Data retention is guaranteed for 20 years at 55°C.
8. Packages: Available in various package types, including WSON and SOIC, allowing flexibility in design.
9. Applications: Ideal for consumer electronics, automotive systems, and IoT devices due to its reliability and performance.
These features make the MX30UF2G18AC-XKI suitable for applications requiring robust non-volatile memory solutions.

Package

The MX30UF2G18AC-XKI is packaged in a 48-ball FBGA (Fine Ball Grid Array) format. This compact package type is designed for high-density applications, providing efficient thermal and electrical performance.

Pinout

The MX30UF2G18AC-XKI is a 2Gbit NAND flash memory device from Macronix. It features a total of 48 pins. The primary functions of these pins include power supply (VCC and VSS), data input/output (I/O0 to I/O7), command, address, and control signals (such as CE#, RE#, WE#, and R/B#). The device supports various interfaces for reading, writing, and erasing data, allowing it to serve applications in embedded systems, mobile devices, and data storage solutions. Additionally, the device utilizes a serial interface for communication. Always refer to the specific datasheet for detailed pin configuration and electrical characteristics.

Manufacturer

The MX30UF2G18AC-XKI is manufactured by Macronix International Co., Ltd. Macronix is a Taiwanese company that specializes in non-volatile memory solutions, including NOR Flash, NAND Flash, and ROM products. Established in 1989, Macronix develops a range of semiconductor products primarily used in consumer electronics, automotive applications, and industrial devices. The company is known for its focus on innovation and quality in memory technology and serves various markets, including networking, telecommunications, and multimedia.

Application

The MX30UF2G18AC-XKI is a 2Gb (256M x 8) NAND Flash memory device primarily used in mobile applications, automotive systems, consumer electronics, and industrial devices. Its features support data storage for smartphones, tablets, and IoT devices, enabling efficient data management in demanding environments. The device is also suitable for firmware storage and as a boot device in embedded systems.

Equivalent

The MX30UF2G18AC-XKI chip, a 2Gb NAND flash memory, has several equivalent products. Notable alternatives include the Micron MT29F2G08ABAEAWP, Samsung K9GAG08U0M, and Toshiba TC58NVG2S3HBAI4. When considering replacements, ensure compatibility with voltage, interface, and form factor specifications. Always check the manufacturer's datasheets for detailed comparisons.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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