MX30UF1G18AC-TI

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MX30UF1G18AC-TI

IC FLASH 1GBIT PARALLEL 48TSOP

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  • Mfr. Partie #MX30UF1G18AC-TI
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  • Fiche de données
  • En stock7049

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Spécifications

Series MX30UF
Part Status Not For New Designs
Base Product Number MX30UF1
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 25ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP
Packaging Tray
Access Time 25 ns

Vue d'ensemble

Description

The MX30UF1G18AC-TI is a 1 Gbit (128 MB) NAND flash memory device from Macronix, designed for applications requiring high-density, non-volatile storage. It utilizes a floating-gate cell technology, typically offering reliable performance and endurance suitable for embedded systems, mobile devices, and consumer electronics. The device operates on a supply voltage of 2.7V to 3.6V, supporting both asynchronous and synchronous interfaces, which facilitate efficient data access and transfer rates.
Key features include a page size of 2 KB, various programming and erasing options, and a robust wear-leveling mechanism that enhances its lifespan. The MX30UF1G18AC-TI also supports multiple data protection features, ensuring secure data storage. Its compact form factor and compatibility with standard NAND protocols make it an ideal choice for designers looking to integrate high-capacity storage solutions into their products. Overall, it balances performance, reliability, and efficiency, making it suitable for a wide range of applications in the evolving memory market.

Features

The MX30UF1G18AC-TI is a 1-gigabit (128MB) NOR Flash memory device from Macronix, designed for high-performance applications. Key features include:
1. Density: 1Gb (128MB) storage capacity.
2. Interface: Supports SPI (Serial Peripheral Interface) and Dual/Quad I/O modes for fast data access.
3. Voltage Range: Operates within a voltage range of 2.7V to 3.6V.
4. Access Speed: Offers high-speed read operations with low latency.
5. Endurance: Typically supports 100,000 program/erase cycles, ensuring durability.
6. Data Retention: Provides data retention of up to 20 years at 85°C.
7. Package Options: Available in various packages, including SOP and WSON, catering to different space requirements.
8. Application Suitability: Ideal for embedded systems, consumer electronics, automotive applications, and other areas requiring reliable non-volatile storage.
These features make the MX30UF1G18AC-TI suitable for applications that demand high-speed data access and long-term storage reliability.

Package

The MX30UF1G18AC-TI is packaged in a 48-ball FBGA (Fine Pitch Ball Grid Array) format. This type of packaging provides a compact footprint and efficient thermal performance, making it suitable for various applications in mobile and embedded systems.

Pinout

The MX30UF1G18AC-TI is a 1Gbit (128MB) NAND Flash memory device with a pin count of 48. It utilizes a TSOP (Thin Small Outline Package) form factor. The primary function of this device is to provide non-volatile storage, which retains data even when power is removed. It features a 1-bit NAND interface and supports various functionalities, including program, erase, and read operations, with a focus on performance and reliability. The device is typically used in applications such as smartphones, tablets, and other portable electronics that require efficient data storage solutions.

Manufacturer

The MX30UF1G18AC-TI is manufactured by Macronix International Co., Ltd. Macronix is a semiconductor company based in Taiwan, specializing in non-volatile memory solutions. They design and produce a variety of memory products, including NOR flash, NAND flash, and ROM chips, which are widely used in consumer electronics, automotive applications, and industrial devices. Established in 1989, Macronix is known for its commitment to innovation and quality in the memory market.

Application

The MX30UF1G18AC-TI is a 1 Gb NOR Flash memory device primarily used in embedded systems. Its application areas include automotive electronics, consumer electronics, industrial automation, IoT devices, and telecommunications. It supports firmware storage, code execution, and data logging, offering high performance and reliability for various applications requiring non-volatile memory solutions.

Equivalent

The MX30UF1G18AC-TI is a 1Gb (128MB) NAND Flash memory chip. Equivalent products include:
1. Micron MT29F1G01ABAEAWP
2. Samsung K9GAG08U0M
3. Hynix H26M31001G2
4. Toshiba TC58NVG0S3HBAI4
Ensure that specifications like voltage, interface, and package type match your requirements when considering alternatives.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire