MX29GL256FHT2I-90Q

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MX29GL256FHT2I-90Q

IC FLASH 256MBIT PARALLEL 56TSOP

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Spécifications

Series MX29GL
Part Status Active
Base Product Number MX29GL256
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 32M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 90ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 56-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 56-TSOP
Packaging Tray
Access Time 90 ns

Vue d'ensemble

Description

The MX29GL256FHT2I-90Q is a 256Mb (32MB) flash memory device produced by Macronix. It utilizes the NOR architecture, making it suitable for applications requiring fast read speeds and random access capabilities. This chip operates on a supply voltage of 2.7V to 3.6V, supporting a range of embedded systems.
Key features include:
1. Density: 256Mb capacity, ideal for storing firmware, code, and data.
2. Speed: With a maximum access time of 90 ns, it provides quick data retrieval.
3. Interface: Supports a parallel interface for easy integration into various designs.
4. Endurance and Reliability: Offers high endurance with around 100,000 program/erase cycles and is designed for long-term data retention.
5. Packages: Available in multiple package options, including SOP and WSON, for flexible design implementations.
This memory is commonly used in consumer electronics, automotive systems, networking equipment, and industrial applications where non-volatile storage is essential.

Features

The MX29GL256FHT2I-90Q is a 256 Megabit (32MB) NOR Flash memory chip. Key features include:
1. Memory Density: 256Mb (32MB) storage capacity.
2. Interface: Supports a parallel interface for easy integration with microcontrollers and processors.
3. Speed: Operating frequency of up to 90ns for fast data access.
4. Voltage Range: Operates at a supply voltage of 2.7V to 3.6V, making it suitable for low-power applications.
5. Sector Architecture: Contains multiple sectors for flexible memory management, allowing for efficient data storage and erasure.
6. Erase/Program Cycles: Supports multiple program and erase cycles, typically rated for at least 100,000 cycles.
7. Temperature Range: Available in industrial-grade versions, supporting extended temperature ranges.
8. Durability: Features a 20-year data retention capability, ensuring data integrity over time.
This component is commonly used in embedded systems, telecommunications, and consumer electronics for firmware storage and system booting applications.

Package

The MX29GL256FHT2I-90Q is packaged in a TSOP (Thin Small Outline Package) form factor, specifically a 48-pin TSOP with dimensions suitable for high-density applications. This package type allows for efficient board space utilization while providing reliable performance in various electronic devices.

Manufacturer

The manufacturer of the MX29GL256FHT2I-90Q is Macronix International Co., Ltd. Macronix is a semiconductor company based in Taiwan that specializes in the design, development, and manufacturing of non-volatile memory products, including NOR Flash and ROM. Founded in 1989, Macronix focuses on providing high-quality memory solutions for a variety of applications, such as consumer electronics, automotive, and industrial markets. The company is known for its innovation in memory technologies and aims to deliver reliable and efficient products to meet the growing demands of the semiconductor market.

Application

The MX29GL256FHT2I-90Q is a 256Mb NOR Flash memory chip commonly used in embedded systems, automotive applications, consumer electronics, and industrial controls. Its applications include firmware storage, code execution, data logging, and system boot-up processes, particularly in devices requiring fast read speeds and reliability, such as smartphones, tablets, and IoT devices.

Equivalent

Equivalent products to the MX29GL256FHT2I-90Q chip include the Winbond W25Q256FV, Micron MT29F256G08, and Spansion S25FL256S. These chips offer similar specifications, such as 256Mb capacity and comparable interface features. Always verify compatibility based on specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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3. Transfert bancaire

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