MX25L12855FXDI-10G

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MX25L12855FXDI-10G

IC FLASH 128MBIT SPI 24CSPBGA

  • Fabricant
  • Mfr. Partie #MX25L12855FXDI-10G
  • Paquet 24-TBGA,CSPBGA
  • Fiche de données
  • En stock3574

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Spécifications

Package Tray
Series MXSMIO™
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NOR
MemorySize 128Mb (16M x 8)
MemoryInterface SPI
ClockFrequency 104 MHz
WriteCycleTime-WordPage 30µs, 3ms
Voltage-Supply 2.7V ~ 3.6V
OperatingTemperature -40°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 24-TBGA, CSPBGA

Vue d'ensemble

Description

The MX25L12855FXDI-10G is a 128Mb (16MB) serial NOR Flash memory device from Macronix, designed for high-performance applications. It uses the SPI (Serial Peripheral Interface) protocol, enabling efficient data transfer and ease of integration with various microcontrollers and processors. The device supports a wide operating voltage range (2.7V to 3.6V), making it suitable for diverse power environments.
Key features include fast read speeds (up to 104 MHz), a variety of programming and erasure options, and a robust erase architecture that supports sector and block erasure. It also offers features like dual and quad I/O modes for improved performance. The MX25L12855FXDI-10G is commonly used in consumer electronics, automotive applications, and industrial devices requiring reliable non-volatile storage.
Its compact 8-pin SOIC package ensures minimal board space usage, while its endurance and data retention specs make it well-suited for applications needing longevity and reliability.

Features

The MX25L12855FXDI-10G is a 128Mb (16MB) Serial NOR Flash memory chip manufactured by Macronix. Key features include:
1. Interface: It supports a Quad SPI interface, enabling high-speed data transfer rates of up to 133 MB/s.
2. Memory Architecture: Utilizes a 3.0V power supply with a uniform 4KB sector architecture, facilitating flexible data storage and management.
3. Erase and Write: Supports sector, block, and chip erase operations, with a program/erase cycle endurance of up to 100,000 cycles.
4. Data Retention: Provides a data retention period of up to 20 years under standard conditions.
5. Package Options: Available in a 16-pin SOIC (Standard Outline IC) package, as well as various BGA and WSON options for space-constrained applications.
6. Security Features: Includes features like hardware and software write protection, ensuring data integrity and security.
7. Applications: Commonly used in consumer electronics, automotive, and industrial applications for code and data storage.
This combination of features makes the MX25L12855FXDI-10G suitable for a wide range of embedded applications.

Package

The MX25L12855FXDI-10G comes in an 8-pin SOIC (Small Outline Integrated Circuit) package, specifically designed for surface mount applications.

Pinout

The MX25L12855FXDI-10G is a 128Mb (16MB) SPI Flash memory chip. It features a total of 16 pins. The primary functions of these pins are as follows:
1. VCC (Power Supply): Provides power to the chip.
2. GND (Ground): Common ground reference.
3. SCK (Serial Clock): Clock input for SPI communication.
4. SI (Serial Input): Data input pin for SPI.
5. SO (Serial Output): Data output pin for SPI.
6. CS# (Chip Select): Active low chip select for SPI operation.
7. Additional pins include:
- WP# (Write Protect): Active low write protection.
- RESET# (Reset): Active low reset pin, used to reset the chip.
The MX25L12855FXDI-10G supports various modes of operation, including standard SPI and dual/quad I/O modes for higher data transfer rates.

Manufacturer

The MX25L12855FXDI-10G is manufactured by Macronix International Co., Ltd. Macronix is a semiconductor company based in Taiwan that specializes in the design, development, and manufacturing of non-volatile memory solutions, including Flash memory and Mask ROM. Founded in 1989, the company serves various markets, including consumer electronics, computing, automotive, and industrial applications. Macronix is recognized for its focus on high-quality memory products and technological innovation, enabling efficient data storage and retrieval for a wide range of devices.

Application

The MX25L12855FXDI-10G is a 128Mb SPI NOR flash memory device typically used in applications such as consumer electronics (smartphones, tablets), automotive systems (infotainment, navigation), industrial equipment (automation controllers), and IoT devices (sensors, smart home products). Its features, like fast read speeds and low power consumption, make it suitable for code storage, firmware updates, and data logging in embedded systems.

Equivalent

The MX25L12855FXDI-10G is a 128Mb (16MB) SPI Flash memory chip. Equivalent products include:
1. Winbond W25Q128JV
2. Micron MT25QL128ABA
3. Spansion S25FL128S
These alternatives offer similar specifications, including 128Mb capacity and SPI interface, but may differ in specific features and performance. Always check datasheets for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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