MT62F2G32D4DS-023 WT:C

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MT62F2G32D4DS-023 WT:C

DRAM LPDDR5 64Gbit 32 315/315 TFBGA 4 WT

  • Fabricant
  • Mfr. Partie #MT62F2G32D4DS-023 WT:C
  • Paquet
  • Fiche de données
  • En stock15574

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Spécifications

Packaging Tray
Standard Pack Qty 1050

Vue d'ensemble

Description

The MT62F2G32D4DS-023 WT:C is a memory component from Micron Technology, specifically a DDR3 (Double Data Rate 3) SDRAM (Synchronous Dynamic Random-Access Memory) chip. It typically features a capacity of 2 gigabits (Gb) and is organized as 256 Megabytes (MB) x 32 bits. This chip is designed for high-performance applications, offering improved speed and data transfer rates compared to older memory technologies.
The "WT:C" designation refers to the part's specific grade and packaging, indicating it's a commercial-grade part suitable for a range of consumer electronics. The MT62F2G32D4DS-023 WT:C is commonly used in various applications, including PCs, laptops, and embedded systems, where reliable memory performance is critical.
It typically supports a range of operating voltages, allowing for flexibility in design. For detailed specifications, including speed, timing parameters, and pin configurations, it's advisable to consult the official Micron datasheet or technical documentation.

Features

The MT62F2G32D4DS-023 WT:C is a 2GB (2 Gbit) DDR2 SDRAM memory chip produced by Micron Technology. It features a 64-bit wide data bus and operates at a supply voltage of 1.8V, making it suitable for various applications where low power consumption is essential. The chip is designed for high-speed performance, supporting data rates up to 800 MT/s (mega transfers per second).
This memory is primarily used in mobile devices, computing applications, and consumer electronics. The "D4" in the part number indicates it is a DDR2 device, while the "DS" denotes it has a double-sided design, facilitating easier integration in multi-layer PCB layouts. The “-023” part indicates the specific speed grade. With built-in thermal and electrical reliability features, it ensures consistent performance under varying conditions. Overall, the MT62F2G32D4DS-023 WT:C is designed for efficient data processing in energy-sensitive environments.

Package

The MT62F2G32D4DS-023 WT:C is typically packaged in a FBGA (Fine Ball Grid Array) format, which is designed for high-density applications. This package type offers a compact design with improved thermal and electrical performance suitable for memory devices.

Pinout

The MT62F2G32D4DS-023 WT:C is a 2Gb (2 gigabit) DDR3 SDRAM memory chip. It typically has a pin count of 78, arranged in a standard ball grid array (BGA) package.
The primary functions of this memory chip include:
- Data Storage: It serves as volatile memory for temporary data storage in computing systems.
- Data Transfer: Supports high-speed data transfer with a clock frequency of up to 1066 MT/s (million transfers per second).
- Memory Organization: Features a 2x32 bit organization, allowing efficient data handling and access.
It is commonly used in various electronic devices, including smartphones, tablets, and other consumer electronics. The "C" at the end of the part number indicates the chip is compliant with specific environmental standards (e.g., RoHS).

Manufacturer

The manufacturer of the MT62F2G32D4DS-023 WT:C is Micron Technology, Inc. Micron is an American multinational corporation that specializes in the production of memory and storage solutions, including DRAM, NAND flash memory, and solid-state drives (SSDs). Founded in 1978 and headquartered in Boise, Idaho, Micron is a key player in the semiconductor industry, serving various sectors including computing, mobile, automotive, and industrial markets. The company focuses on innovation and technology advancement, providing high-performance memory products that meet the demands of modern applications.

Application

The MT62F2G32D4DS-023 WT:C is a mobile DRAM chip commonly used in applications such as smartphones, tablets, and other portable devices. It supports high-speed data processing and efficient power consumption, making it suitable for applications requiring fast memory access, like gaming, multimedia processing, and multitasking environments.

Equivalent

The MT62F2G32D4DS-023 WT:C chip is a 2Gb DDR2 SDRAM memory chip. Equivalent products include the K4T1G164EB-HCF7 from Samsung, the MDTK2G32D4DT from Micron, and the H5TQ2G83BFR from Hynix. Ensure compatibility by checking specs like voltage, timing, and package type.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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