MT62F1G32D2DS-026 WT:B

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MT62F1G32D2DS-026 WT:B

1.05V 32Gbit 200-WFBGA(10x14.5) Memory (ICs) RoHS

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  • Mfr. Partie #MT62F1G32D2DS-026 WT:B
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Spécifications

Packaging 200-WFBGA(10x14.5)
Memory Size 32Gbit
Voltage - Supply 1.05V

Vue d'ensemble

Description

The MT62F1G32D2DS-026 WT:B is a type of mobile DRAM (Dynamic Random Access Memory) chip manufactured by Micron Technology. This specific model is designed for mobile applications, offering a balance of performance and power efficiency. It typically features a density of 1 gigabit (1G) with a 32-bit data width, suitable for smartphones, tablets, and other portable devices.
Key specifications may include low power consumption, high-speed data transfer rates, and support for various mobile standards. The "WT:B" designation often indicates specific manufacturing or performance characteristics, such as temperature ratings or package types.
Overall, the MT62F1G32D2DS-026 WT:B plays a crucial role in enhancing the performance of mobile devices by providing fast and efficient memory solutions, contributing to improved multitasking, gaming experiences, and overall system responsiveness.

Features

The MT62F1G32D2DS-026 WT:B is a DDR2 SDRAM memory chip manufactured by Micron Technology. It features a 1 Gbit (128 MB) density and operates at a voltage of 1.8V. The chip utilizes a 16-bit data width, making it suitable for various applications such as mobile devices and consumer electronics.
Key features include:
- Speed: Supports data rates up to 400 MT/s.
- Architecture: Dual-bank architecture enhances performance and efficiency.
- Package: Comes in a compact FBGA (Fine Ball Grid Array) package, enabling efficient board layout.
- Thermal and Electrical Characteristics: Designed for low power consumption, making it ideal for battery-operated devices.
The MT62F1G32D2DS-026 WT:B is designed for compatibility with DDR2 interfaces and adheres to industry standards for reliability and performance.

Package

The MT62F1G32D2DS-026 WT:B is a DRAM memory chip packaged in a 78-ball BGA (Ball Grid Array) format. This type of packaging offers a compact design and efficient thermal management, making it suitable for mobile and embedded applications.

Pinout

The MT62F1G32D2DS-026 WT:B is a mobile DRAM chip from Micron Technology. It is a 1Gb (Gigabit) DDR2 SDRAM device, specifically designed for low-power applications. The pin count for this device is typically 54 pins, which are organized in a BGA (Ball Grid Array) package.
The primary functions of the pins include:
1. Data Input/Output (DQ): Used for bi-directional data transfer.
2. Address Inputs (A): Specifies the address of the memory location being accessed.
3. Control Inputs (CK, CK#, CS#, RAS#, CAS#, WE#): These pins control the timing and operation of the memory, including read/write operations.
4. Power Supply and Ground (VDD, VSS): Provide the necessary power and ground connections.
5. Additional Control Pins (ODT, DQM): Help manage data outputs and enable/disable on-die termination.
This chip is suitable for applications requiring high-speed data processing and low power consumption.

Manufacturer

The MT62F1G32D2DS-026 WT:B is manufactured by Micron Technology, Inc. Micron is an American multinational corporation that specializes in semiconductor devices, particularly memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, Micron is one of the largest manufacturers of DRAM, NAND flash memory, and solid-state drives (SSDs). The company serves a diverse range of markets, including consumer electronics, computing, mobile devices, and data centers. Micron is known for its innovation in memory technology and plays a crucial role in the global electronics supply chain.

Application

The MT62F1G32D2DS-026 WT:B is a mobile RAM (DRAM) device used primarily in mobile applications, such as smartphones, tablets, and other portable devices. Its key applications include data storage for operating systems, application data, graphics processing, and multitasking capabilities, enabling efficient performance in compact electronic devices.

Equivalent

The MT62F1G32D2DS-026 WT:B is a 1Gb DDR2 SDRAM chip. Equivalent products may include other 1Gb DDR2 chips from manufacturers like Samsung (K4T1G164QE), Hynix (HYMD512M646C6), and Micron (MT47H64M16HR-25). Always verify compatibility in terms of dimensions, voltage, and timing specifications before substitution.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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