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MT53E2G32D4DE-046WT:C
- Fabricant
- Mfr. Partie #MT53E2G32D4DE-046WT:C
- Paquet
- Fiche de données
- En stock5341
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Spécifications
| Manufacturer | JLCPCB Assembly |
| Package | FBGA-200_14.5X10 |
Vue d'ensemble
Description
Key features of the MT53E2G32D4DE-046WT:C include its 2Gb density, x32 configuration, and the ability to operate at frequencies of up to 3200 MHz. It supports various features such as deep power-down mode and temperature compensation refresh, enhancing its efficiency and performance in energy-sensitive applications.
The chip is designed to operate in a wide temperature range, which adds to its versatility across different environmental conditions. Its compact size and low power consumption make it an optimal choice for devices where space and battery life are critical considerations. Overall, this memory chip is engineered to deliver reliable performance while extending battery life in advanced electronic devices.
Features
Key features of the MT53E2G32D4DE-046WT:C include:
1. Capacity and Organization: It typically offers 8Gb (gigabit) of storage capacity, organized as 2Gb x 32.
2. Low Power Consumption: As an LPDDR4X module, it operates at a lower voltage than standard DDR4, which enhances battery life in portable devices.
3. High Data Transfer Rates: It supports data transfer rates up to 4266 MT/s (megatransfers per second), providing fast performance for high-speed data processing and multitasking.
4. Temperature Range: It is designed to operate efficiently across a wide temperature range, making it suitable for various environmental conditions.
5. Advanced Features: The module supports features like deep power-down mode and self-refresh, which further reduce power usage during periods of low activity.
These features make the MT53E2G32D4DE-046WT:C an ideal choice for power-efficient, high-performance mobile computing solutions.
Package
Pinout
Pin Count:
The pin count for this type of memory chip typically ranges around 200 balls, as LPDDR4 is commonly packaged in a FBGA (Fine-pitch Ball Grid Array) format. The exact pin count can vary slightly depending on the specific package design.
Function:
The primary function of the MT53E2G32D4DE-046WT:C is to provide high-speed, low-power volatile memory storage for use in mobile and other power-sensitive applications. It supports features like low power consumption, high data transfer rates, and efficient memory bandwidth utilization, making it suitable for smartphones, tablets, and other portable electronic devices. This chip operates at low voltages and supports the LPDDR4 interface standard, which allows for fast data processing and efficient energy use.
Manufacturer
Application
Equivalent
1. Samsung K4FBE3D4HM-MGCH
2. Hynix H9HCNNN8KUMLHR-NEE
3. Kingston D2516EC4BXGGB
These alternatives offer similar performance and specifications, suitable for applications requiring low power and high-speed data processing. Always check the datasheets for compatibility with your specific use case.
Expédition
Méthodes d'expéditionNous
offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.
Référence des frais d'expédition (DHL/FedEx):
DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.
FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.
Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.
Paiements
Payment Methods
Le terme de paiement est 100% prépayé.
Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:
1. PayPal
2. Carte de crédit/débit
3. Transfert bancaire
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