MT53E128M32D2DS-053 IT:A

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MT53E128M32D2DS-053 IT:A

DRAM LPDDR4 4Gbit 32 200/264 WFBGA 2 IT

  • Fabricant
  • Mfr. Partie #MT53E128M32D2DS-053 IT:A
  • Paquet
  • Fiche de données
  • En stock2785

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Spécifications

Packaging Tray
Standard Pack Qty 1360

Vue d'ensemble

Description

The MT53E128M32D2DS-053 IT:A is a high-performance memory component from Micron Technology, specifically a DRAM (Dynamic Random-Access Memory) device. It belongs to the DDR4 (Double Data Rate 4) SDRAM family and features a 128 Meg x 32 configuration. This memory chip operates at a frequency of 1.6 GHz, delivering efficient data transfer rates suitable for various applications, including servers, workstations, and high-performance computing systems.
Key features include low voltage operation for power efficiency, improved speed, and reliability. The "053" in the model number indicates a specific speed grade, while "IT:A" denotes the packaging and environmental specifications, ensuring compatibility in industrial applications. This memory is designed to meet stringent performance and endurance standards, making it suitable for data-intensive tasks.
Overall, the MT53E128M32D2DS-053 IT:A is a robust choice for those seeking high-capacity, efficient, and reliable memory solutions in demanding computing environments.

Features

The MT53E128M32D2DS-053 IT:A is a high-performance DRAM memory chip from Micron Technology. It features:
1. Memory Type: DDR4 SDRAM.
2. Density: 128 Megabytes (128M x 32) configuration.
3. Speed: Operates at a data rate of 1.6 GT/s (Gigatransfers per second).
4. I/O Voltage: Typically operates at 1.2V.
5. Package Type: Available in a compact FBGA (Fine Ball Grid Array) package.
6. Temperature Range: Industrial grade, suitable for operation in harsher environments.
7. Burst Length: Supports burst lengths of 8, enhancing data throughput.
8. Data Width: 32 bits wide, allowing efficient data processing for various applications.
This memory chip is well-suited for applications requiring robust performance and reliability, such as automotive, industrial control systems, and telecommunications.

Package

The MT53E128M32D2DS-053 IT:A is a DRAM memory chip packaged in a 78-ball FBGA (Fine Ball Grid Array) format. This package type allows for high-density mounting and efficient heat dissipation, making it suitable for various applications in mobile devices and computing systems.

Pinout

The MT53E128M32D2DS-053 IT:A is a DDR4 SDRAM memory chip with a pin count of 78. This memory device features a 128 Meg x 32 configuration, which means it has a total capacity of 4 GB. The key functions of the pins include power supply, ground, data input/output, address lines, control signals (such as clock, chip select, and write/read commands), and other auxiliary signals for proper operation and interfacing with memory controllers. The chip operates at a frequency of up to 1.6 GHz and is designed for high-performance applications, offering improved data transfer rates and energy efficiency compared to previous memory technologies.

Manufacturer

The MT53E128M32D2DS-053 IT:A is manufactured by Micron Technology, Inc. Micron is a leading global provider of advanced semiconductor solutions, specializing in memory and storage technologies. The company produces a wide range of memory products, including DRAM, NAND flash memory, and solid-state drives (SSDs), which are used in various applications such as computing, mobile devices, and automotive systems. Founded in 1978 and headquartered in Boise, Idaho, Micron is known for its innovation in memory technology and plays a significant role in the semiconductor industry.

Application

The MT53E128M32D2DS-053 IT:A is a mobile DRAM memory chip designed for applications in smartphones, tablets, and other portable devices. It is optimized for high performance and low power consumption, making it suitable for advanced mobile computing, gaming, and multimedia applications where efficient data processing and energy efficiency are crucial.

Equivalent

The MT53E128M32D2DS-053 IT:A chip is a DDR4 SDRAM memory chip. Equivalent products may include similar DDR4 chips from manufacturers like Samsung (K4AAG085WB-BCTD), Micron (MT53E128M32D2DS), and Hynix (H5AN8G6NAFR-TFC). It’s essential to verify specifications such as density, speed, and configuration for compatibility. Always consult datasheets for precise equivalency.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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