MT48LC32M16A2P-75:C

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MT48LC32M16A2P-75:C

IC DRAM 512MBIT PAR 54TSOP II

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Spécifications

Part Status Discontinued at DigiKey
Base Product Number MT48LC32M16A2
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package 54-TSOP (0.400", 10.16mm Width)
Supplier Device Package 54-TSOP II
Packaging Tray
Access Time 5.4 ns

Vue d'ensemble

Description

The MT48LC32M16A2P-75:C is a dynamic random-access memory (DRAM) chip manufactured by Micron Technology. It features a 512Mb capacity, organized as 32 Meg x 16 bits, and utilizes a double data rate (DDR) architecture. The "75" in its designation indicates a specified access time of 75 nanoseconds, which is crucial for determining the performance speed of memory operations.
This DRAM operates on a voltage of 2.5V and utilizes a 3.2V I/O voltage, making it suitable for various low-power applications. The device supports a synchronous interface, allowing for efficient data transfer rates through clock synchronization with the memory controller.
The MT48LC32M16A2P-75:C is often employed in consumer electronics, embedded systems, and various computing applications, providing a balance between performance and power efficiency. Its compact packaging and compatibility with industry-standard protocols make it a versatile choice for modern electronics design.

Features

The MT48LC32M16A2P-75:C is a 512Mb (32Mx16) SDRAM (Synchronous Dynamic Random Access Memory) chip from Micron Technology. Key features include:
1. Density: 512 Megabits, organized as 32 M x 16 bits.
2. Speed: Operates at a clock speed of up to 75 MHz.
3. Voltage: Typically operates at a supply voltage of 3.3V, with an I/O voltage of 2.5V.
4. Data Rate: Supports a high data transfer rate due to its synchronous interface.
5. Latency: Offers low latency options (CAS latency).
6. Architecture: Incorporates a burst mode capability, enhancing performance for sequential data access.
7. Package: Available in a 54-ball FBGA (Fine Ball Grid Array) package for compact design and efficient thermal management.
This memory chip is commonly used in various applications, including telecommunications, consumer electronics, and networking equipment, where high performance and reliability are crucial.

Package

The MT48LC32M16A2P-75:C is typically housed in a TSOP (Thin Small Outline Package) form factor. This package type is designed for surface mounting and is commonly used in DRAM devices.

Pinout

The MT48LC32M16A2P-75:C is a 512Mb (32M x 16) DRAM device with a pin count of 54. This memory chip is designed for use in various applications, including computers and other digital devices.
Key functions of the pins include:
- Address Pins (A0-A11): Used to select specific rows and columns within the memory array.
- Data Pins (DQ0-DQ15): These pins are used for data input and output, transferring 16 bits of data in parallel.
- Control Pins (CS, WE, OE): Control signals for chip select, write enable, and output enable to regulate memory operations.
- Power Supply Pins (VDD, VSS): Provide power to the device and ground connection.
- Clock Pins (if applicable): For synchronous operations, though this specific model is asynchronous.
Overall, the MT48LC32M16A2P-75:C is designed for high-speed memory applications with reliable performance.

Manufacturer

The manufacturer of the MT48LC32M16A2P-75:C is Micron Technology, Inc. Micron is a leading American company that specializes in the production of memory and storage solutions, including DRAM, NAND flash memory, and solid-state drives (SSDs). Founded in 1978 and headquartered in Boise, Idaho, Micron plays a critical role in the semiconductor industry, providing innovative memory technologies for various applications, including computers, mobile devices, and automotive systems. The company focuses on advancing memory technology to meet the growing demands of data-intensive applications.

Application

The MT48LC32M16A2P-75:C is a DRAM memory chip commonly used in applications such as telecommunications, networking equipment, consumer electronics, and industrial devices. It is suitable for use in embedded systems, graphics applications, and other devices requiring high-density memory with low power consumption. Its features make it ideal for applications in laptops, PCs, and various digital appliances that require reliable and efficient memory solutions.

Equivalent

Equivalent products for the MT48LC32M16A2P-75:C chip include the Micron MT48LC32M16A2G-75, Nanya NT5CB256M8DA-75, and Samsung K4S641632D-TC75. These chips share similar specifications, such as density, organization, and speed grade. Ensure to verify the compatibility based on specific application requirements.

Expédition

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DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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