MT29F64G08CBABBWP-12IT:B

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MT29F64G08CBABBWP-12IT:B

IC FLASH 64GBIT PAR 48TSOP I

  • Fabricant
  • Mfr. Partie #MT29F64G08CBABBWP-12IT:B
  • Paquet 48-TFSOP
  • Fiche de données
  • En stock2867

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Spécifications

Package Tray
ProductStatus Obsolete
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NAND
MemorySize 64Gb (8G x 8)
MemoryInterface Parallel
ClockFrequency 83 MHz
Voltage-Supply 2.7V ~ 3.6V
OperatingTemperature -40°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 48-TFSOP (0.724, 18.40mm Width)

Vue d'ensemble

Description

The MT29F64G08CBABBWP-12IT:B is a NAND flash memory chip produced by Micron Technology. It offers a storage capacity of 64 gigabits (GB) and is designed for high-density applications, such as smartphones, tablets, and other embedded systems. Key features include a NAND interface, advanced error correction capabilities, and support for multiple die and page sizes, enhancing its performance and reliability.
This chip utilizes a 3D NAND architecture, which increases storage density and improves endurance compared to traditional 2D NAND technologies. It operates at a voltage range that makes it suitable for various power-sensitive applications. The "12IT" designation indicates a specific speed grade, while the "B" suffix signifies that it is a part of the broader series of Micron memory products.
Overall, the MT29F64G08CBABBWP-12IT:B is ideal for applications requiring efficient data storage with quick access times, making it a popular choice in modern electronic devices.

Features

The MT29F64G08CBABBWP-12IT:B is a NAND flash memory device from Micron Technology, specifically designed for high-density storage applications. Here are its key features:
1. Capacity: 64 Gb (8 GB) of storage, suitable for a variety of applications.
2. Interface: Toggle NAND interface, enabling high-speed data transfer rates.
3. Speed: Supports read speeds up to 400 MT/s and write speeds up to 200 MT/s, enhancing performance.
4. Architecture: 2-bit per cell (MLC) architecture allows for efficient data storage.
5. Endurance: Up to 3,000 program/erase cycles, ensuring durability for consumer electronics and industrial applications.
6. Operating Voltage: Typically operates at 1.8V for core and 3.3V for I/O, supporting low power consumption.
7. Page Size: 8 KB page size with a block size of 128 KB, which is optimal for larger data transfers.
8. Temperature Range: Supports a wide industrial temperature range, making it suitable for various environments.
This device is ideal for use in smartphones, tablets, SSDs, and other embedded systems where reliable and efficient data storage is critical.

Package

The MT29F64G08CBABBWP-12IT:B is packaged in a BGA (Ball Grid Array) format, specifically a 48-ball BGA package. This type of packaging is designed for efficient thermal management and compact design in electronic applications.

Pinout

The MT29F64G08CBABBWP-12IT:B is a NAND flash memory device from Micron, featuring a pin count of 48. This device operates with a dual die structure, offering a 64 Gb (8 GB) storage capacity.
The primary functions of the pins include:
1. Data Input/Output (DQ0-DQ7): 8-bit data bus for reading and writing data.
2. Command/Address Input (A0-A6, CE#, WE#, RE#): Used for command and address inputs, along with chip enable, write enable, and read enable signals.
3. R/B# (Ready/Busy): Indicates the status of the device (ready or busy).
4. Vcc/Vss: Power supply and ground.
5. WP# (Write Protection): Provides write protection functionality.
6. CS# (Chip Select): Activates the device for communication.
This NAND flash is commonly used in applications requiring reliable storage solutions such as smartphones, tablets, and other embedded systems.

Manufacturer

The manufacturer of the MT29F64G08CBABBWP-12IT:B is Micron Technology, Inc. Micron is an American company that specializes in semiconductor manufacturing, particularly in memory and storage solutions. Established in 1978, Micron is one of the largest producers of DRAM, NAND flash memory, and other memory technologies. The company serves a wide range of markets, including computing, networking, and consumer electronics. Micron is known for its innovation in memory technology and plays a significant role in the global semiconductor industry.

Application

The MT29F64G08CBABBWP-12IT:B is a NAND flash memory chip used in various applications, including mobile devices, consumer electronics, automotive systems, industrial automation, and data storage solutions. It is ideal for use in solid-state drives (SSDs), smartphones, tablets, and embedded systems due to its high capacity, reliability, and fast data access speeds.

Equivalent

The MT29F64G08CBABBWP-12IT:B chip is a 64Gb NAND Flash memory. Equivalent products include the Samsung K9GAG08U0M, Micron MT29F64G08ABAEAWP, and Toshiba TH58TEG7D4LBAIL. When considering replacements, ensure compatibility in terms of interface, voltage, and package type. Always refer to the manufacturer's datasheets for specific features and performance characteristics.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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