MT29F2G08ABBEAH4:E

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MT29F2G08ABBEAH4:E

IC FLASH 2GBIT PARALLEL 63VFBGA

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  • Mfr. Partie #MT29F2G08ABBEAH4:E
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  • Fiche de données
  • En stock8786

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Spécifications

Part Status Obsolete
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface Parallel
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
Base Product Number MT29F2G08

Vue d'ensemble

Description

The MT29F2G08ABBEAH4:E is a NAND flash memory device manufactured by Micron Technology. It features a 2 gigabit (256 MB) capacity, utilizing a 1.8V power supply for operation. This device is designed for high-density storage applications, making it suitable for mobile devices, consumer electronics, and embedded systems.
Key features include a Multi-Level Cell (MLC) architecture, providing higher data storage density, and support for various interface protocols. The device offers fast read and write speeds, enabling efficient data access and retrieval. It incorporates error correction and wear leveling techniques to enhance reliability and longevity.
This NAND flash is part of the broader family of Micron's NAND products, which are known for their durability and performance in demanding environments. The 'E' in the part number designates that the device is part of the extended product line, ensuring better availability and support for long-term projects. Overall, the MT29F2G08ABBEAH4:E is a versatile choice for applications requiring robust flash memory solutions.

Features

The MT29F2G08ABBEAH4:E is a NAND Flash memory device from Micron Technology, designed for high-density storage applications. Here are its key features:
1. Capacity: 2 Gb (Gigabits) of storage, equivalent to 256 MB (Megabytes).
2. Interface: Supports ONFI (Open NAND Flash Interface) allowing for high-speed data transfer.
3. Technology: Built using 1x nm NAND Flash process technology, enhancing performance and reliability.
4. ECC Support: Features built-in Error Correction Code (ECC) capabilities to ensure data integrity.
5. Page Size: Typically has a page size of 2 KB, optimizing read and write operations.
6. Block Size: Organized in blocks for efficient data management, usually around 128 KB.
7. Endurance: High endurance rating suitable for various applications, including mobile, automotive, and consumer electronics.
8. Data Retention: Promises a long data retention period, often exceeding 10 years under appropriate conditions.
This device is ideal for applications requiring efficient, high-density memory solutions.

Package

The MT29F2G08ABBEAH4:E is a NAND Flash memory device from Micron Technology, typically available in a TSOP (Thin Small Outline Package) type package. This package type allows for mounting on printed circuit boards (PCBs) and is designed for space-efficient applications in consumer electronics and mobile devices.

Pinout

The MT29F2G08ABBEAH4:E is a NAND Flash memory chip from Micron Technology with a pin count of 48. It is generally available in a TSOP (Thin Small Outline Package) format.
The primary functions of the pins include:
- Data Input/Output (DQS, DQ0-DQ7): These pins are used for data transfer in parallel format.
- Command/Address Inputs (CLE, ALE): Control the command and address inputs for data operations.
- Chip Enable (CE#): Activates the memory chip for read/write operations.
- Write Protect (WP#): Used to protect the data from being overwritten.
- Ready/Busy (R/B#): Indicates the status of the chip (ready or busy).
- Ground (GND) and Power Supply (VCC): Provide the necessary power and ground connections.
Overall, the chip is designed for high-density storage applications, supporting various NAND Flash operations.

Manufacturer

The manufacturer of the MT29F2G08ABBEAH4:E is Micron Technology, Inc. Micron is a leading global provider of advanced semiconductor solutions and is primarily known for its memory and storage products, including DRAM, NAND flash memory, and other memory technologies. Founded in 1978 and headquartered in Boise, Idaho, Micron serves a wide range of markets, including consumer electronics, computing, and mobile devices. The company is recognized for its innovation in memory technology and its role in the semiconductor industry. Micron is publicly traded and is considered one of the largest manufacturers of memory products worldwide.

Application

The MT29F2G08ABBEAH4:E is a NAND Flash memory chip used in various applications, including mobile devices, consumer electronics, embedded systems, and automotive applications. It provides data storage solutions for smartphones, tablets, SSDs, and IoT devices, offering high density and fast read/write speeds for efficient data management.

Equivalent

The MT29F2G08ABBEAH4:E chip is a 2Gb NAND Flash memory chip by Micron Technology. Equivalent products can include similar density NAND Flash chips from other manufacturers, such as:
1. Samsung K9GAG08U0M
2. SK Hynix H26M52003GTR
3. Toshiba THGBM2G8D2KBAIL
Ensure compatibility in terms of specifications, package type, and voltage before substituting.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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