MPC8360ECVVAJDGA

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MPC8360ECVVAJDGA

IC MPU MPC83XX 533MHZ 740TBGA

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Spécifications

Series MPC83xx
Part Status Obsolete
Core Processor PowerPC e300
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 533MHz
Co-Processors/DSP Communications; QUICC Engine, Security; SEC
RAM Controllers DDR, DDR2
Graphics Acceleration No
Ethernet 10/100/1000Mbps (1)
USB USB 1.x (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Security Features Cryptography, Random Number Generator
Mounting Type Surface Mount
Package / Case 740-LBGA
Supplier Device Package 740-TBGA (37.5x37.5)
Additional Interfaces DUART, HDLC, I2C, PCI, SPI, UART
Base Product Number MPC8360

Vue d'ensemble

Description

The MPC8360ECVVAJDGA is a member of the MPC8360E family of PowerPC processors developed by NXP Semiconductors (formerly Freescale). It is designed for high-performance applications, particularly in networking and communications. This processor features a dual-core architecture based on the PowerPC e600 core, allowing it to efficiently handle multiple tasks simultaneously.
Key specifications include a processing speed of up to 1 GHz, support for DDR2/DDR3 memory, and integrated high-speed interfaces such as Ethernet and PCI Express. The MPC8360E is built to deliver robust performance in embedded systems, with a focus on power efficiency. It also includes hardware acceleration for networking functions, which is beneficial for applications requiring rapid data processing.
The processor is commonly used in applications such as routers, switches, and other telecommunications equipment, where reliable, high-speed data handling is critical. Overall, the MPC8360ECVVAJDGA is a versatile and powerful solution for modern embedded computing needs.

Features

The MPC8360ECVVAJDGA is a PowerQUICC III processor from NXP Semiconductors, primarily designed for embedded applications. Key features include:
1. Architecture: It is based on the PowerPC architecture, offering a 32-bit/64-bit RISC core.
2. Clock Speed: Operates at up to 800 MHz, delivering robust processing power.
3. Core: Features a single core with dual-threading capability for enhanced multitasking.
4. Memory Support: Supports up to 2 GB of DDR2 SDRAM and includes a memory controller.
5. I/O Interfaces: Integrates multiple high-speed interfaces, including PCI Express, SATA, and Ethernet (up to 10/100/1000 Mbps).
6. Integration: Contains on-chip peripherals like UART, SPI, and I2C for versatile connectivity.
7. Security: Supports various security features for secure communications.
8. Application: Ideal for networking, telecommunications, and industrial control applications.
These features make the MPC8360ECVVAJDGA suitable for demanding embedded system environments.

Package

The MPC8360ECVVAJDGA is packaged in a 676-ball Plastic Ball Grid Array (PBGA) format. This type of package is designed for high-density applications and provides excellent thermal performance and electrical connections.

Pinout

The MPC8360ECVVAJDGA is a PowerPC microprocessor from NXP Semiconductors (formerly Freescale Semiconductor). It features a pin count of 528 pins in a PBGA (Plastic Ball Grid Array) package.
The primary functions of this processor include:
1. Multi-core Architecture: It is designed for high-performance applications, typically in networking and telecommunications.
2. Integrated Peripherals: It includes support for various interfaces such as Ethernet (with integrated MAC), Serial RapidIO, PCI Express, and SATA.
3. Memory Interfaces: It supports DDR2/DDR3 memory interfaces, enabling high-speed data access.
4. Power Management: It also includes features for power management to enhance energy efficiency.
5. Security Features: The processor offers security functions suitable for embedded applications.
This combination of features makes the MPC8360ECVVAJDGA suitable for a variety of industrial and commercial applications, particularly in environments requiring robust data processing capabilities.

Manufacturer

The manufacturer of the MPC8360ECVVAJDGA is NXP Semiconductors, a global semiconductor company. NXP specializes in designing and manufacturing a wide range of high-performance microcontrollers, microprocessors, and integrated circuits, primarily for automotive, industrial, and consumer electronics markets. The MPC8360 is part of their PowerQUICC series, which targets networking and communications applications. NXP is known for its innovations in secure connectivity solutions and is a leader in automotive and Internet of Things (IoT) technologies.

Application

The MPC8360ECVVAJDGA is a PowerPC-based processor used in various applications, including telecommunications, industrial automation, networking equipment, and embedded systems. It supports high-performance computing tasks and is ideal for routers, switches, and wireless base stations, offering reliability and efficiency in data processing and communication. Its architecture also enables real-time applications in automotive and aerospace systems.

Equivalent

The MPC8360ECVVAJDGA chip is a PowerPC-based processor. Equivalent products include:
1. MPC8360E (same family with slight variations)
2. MPC8360 (different package options)
3. MPC8560 (higher performance variant)
4. MPC832x series (lower-end alternatives)
It's important to verify specific features and compatibility based on application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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