MCIMX6Z0DVM09AB

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MCIMX6Z0DVM09AB

IC MPU I.MX6ULZ 900MHZ 289MAPBGA

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Spécifications

Package Tray
Series i.MX6
ProductStatus Active
CoreProcessor ARM® Cortex®-A7
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 900MHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAMControllers LPDDR2, DDR3, DDR3L
GraphicsAcceleration No
Display&InterfaceControllers Keypad
USB USB 2.0 OTG + PHY (2)
OperatingTemperature 0°C ~ 95°C (TJ)
SecurityFeatures A-HAB, ARM TZ, CSU, SJC, SNVS
Package/Case 289-LFBGA

Vue d'ensemble

Description

The MCIMX6Z0DVM09AB is a member of NXP Semiconductors' i.MX 6 series, specifically designed for applications requiring high-performance multimedia processing and connectivity. This System on Chip (SoC) features a dual-core ARM Cortex-A9 processor, operating at speeds up to 1 GHz. It supports advanced graphics with 3D GPU capabilities and full HD video playback, making it suitable for applications such as automotive infotainment, industrial control, and consumer electronics.
Key features include a variety of connectivity options like USB, Ethernet, and HDMI, as well as support for multiple display interfaces. The device also integrates robust security features, ensuring data protection in various applications. With its scalable architecture, the MCIMX6Z0DVM09AB can be tailored for diverse embedded systems, combining performance efficiency with low power consumption. This makes it a popular choice for developers seeking to create rich multimedia experiences in their products.

Features

The MCIMX6Z0DVM09AB is a member of the NXP i.MX 6 series of application processors. Key features include:
1. Architecture: Dual-core ARM Cortex-A9 processor with a frequency up to 1 GHz.
2. Graphics: Integrated 3D graphics engine with support for OpenGL ES 2.0 and OpenVG 1.1.
3. Memory Support: Up to 4GB DDR3/DDR3L RAM support, with various memory interfaces.
4. Video: Full HD 1080p video decode and encode capabilities, supporting multiple formats.
5. Connectivity: Integrated Ethernet MAC, USB 2.0 host/device, CAN, I2C, SPI, and UART interfaces.
6. Security: Hardware-based security features, including a secure boot option.
7. Power Management: Flexible power management features for energy-efficient operation.
8. Operating Systems: Compatible with various OS including Linux, Android, and real-time operating systems.
This SoC is widely used in applications like automotive systems, industrial control, and multimedia devices.

Package

The MCIMX6Z0DVM09AB is packaged in a 388-ball FCLGA (Fine-Pitch Ball Grid Array) form factor. This type of package provides a compact design and facilitates efficient thermal and electrical performance for integrated circuits.

Pinout

The MCIMX6Z0DVM09AB is a member of the NXP i.MX 6 series of applications processors. It features a 388-ball FCLGA (Fine Pitch Ball Grid Array) package, making it relatively compact for integration into systems.
Key functions of the MCIMX6Z0DVM09AB include:
- A dual-core ARM Cortex-A9 processor that supports high-performance applications.
- Multimedia capabilities, including support for 1080p video playback and advanced graphics.
- Multiple interfaces such as USB, HDMI, and Ethernet for connectivity.
- Support for various memory types including DDR3 and LPDDR2.
- Integrated GPU for enhanced graphics performance.
Overall, the chip is designed for applications in consumer electronics, industrial automation, and automotive systems, providing robust processing power and multimedia features in a compact form factor.

Manufacturer

The MCIMX6Z0DVM09AB is manufactured by NXP Semiconductors, a global semiconductor company that specializes in designing and manufacturing a wide range of products, including microprocessors and microcontrollers. NXP focuses on automotive, industrial, IoT, and mobile applications, providing innovative solutions that enable advanced connectivity and processing capabilities. The company is known for its commitment to security and energy efficiency in its product offerings, making it a key player in the semiconductor industry. NXP Semiconductors was formed in 2006 as a spin-off from Philips and has since become a leader in various technology sectors.

Application

The MCIMX6Z0DVM09AB is a versatile processor used in various application areas including industrial automation, automotive systems, medical devices, smart home appliances, and consumer electronics. Its capabilities support multimedia processing, graphics, and connectivity, making it suitable for embedded systems in robotics, digital signage, and IoT applications.

Equivalent

The MCIMX6Z0DVM09AB chip is part of the NXP i.MX 6 series. Equivalent products include the MCIMX6D, MCIMX6Q, and MCIMX6S chips, which offer similar processing capabilities but may differ in core count, graphics performance, and power consumption. For specific applications, the i.MX 6ULL and i.MX 6SoloLite may also serve as alternatives, focusing on lower power consumption and cost. Always check specifications for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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