MCIMX6L3DVN10AB

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MCIMX6L3DVN10AB

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

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Spécifications

Package Tray
Series i.MX6SL
ProductStatus Active
CoreProcessor ARM® Cortex®-A9
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 1.0GHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAMControllers LPDDR2, LVDDR3, DDR3
GraphicsAcceleration Yes
Display&InterfaceControllers Keypad, LCD
Ethernet 10/100Mbps (1)
USB USB 2.0 + PHY (3)
Voltage-I/O 1.2V, 1.8V, 3.0V
OperatingTemperature 0°C ~ 95°C (TJ)
SecurityFeatures ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package/Case 432-TFBGA

Vue d'ensemble

Description

The MCIMX6L3DVN10AB is a member of the NXP i.MX 6 series of applications processors, specifically designed for low-power, high-performance embedded applications. It features a dual-core ARM Cortex-A9 architecture, operating at speeds up to 1 GHz, making it suitable for multimedia, industrial, and automotive applications. This processor supports advanced graphics and video processing capabilities, including 1080p video playback, enabling rich user interfaces and applications.
The i.MX 6L includes integrated security features, such as hardware encryption and secure boot, enhancing its suitability for secure applications. It offers various connectivity options, including Ethernet, USB, and UART, along with support for multiple display interfaces like HDMI and LVDS.
The MCIMX6L3DVN10AB is optimized for low power consumption, making it ideal for battery-operated devices and applications where energy efficiency is crucial. Its flexibility and performance make it a popular choice for embedded systems, tablets, and automotive infotainment solutions.

Features

The MCIMX6L3DVN10AB is a member of the NXP i.MX 6 series of applications processors, designed for embedded applications. Key features include:
1. Cortex-A9 Core: It has a dual-core ARM Cortex-A9 architecture, providing a balance of performance and power efficiency.
2. Clock Speed: Operates at up to 1 GHz.
3. Graphics: Integrated 3D graphics accelerator and 2D graphics engine for enhanced visual performance.
4. Memory Support: Supports DDR3/DDR3L memory with a bandwidth of up to 17.1 GB/s.
5. Video Support: HD video playback, including support for 1080p60 decode and encode.
6. Connectivity: Multiple options including USB, Ethernet, and PCIe, facilitating connectivity in various applications.
7. Low Power Consumption: Designed for low power operation, making it suitable for battery-powered devices.
8. Operating Systems: Supports various OS platforms, including Linux and Android.
These features make the MCIMX6L3DVN10AB suitable for a wide range of applications, including industrial control, automotive, and consumer electronics.

Package

The MCIMX6L3DVN10AB is packaged in a 388-ball MAPBGA (Matrix Array Plastic Ball Grid Array) format. This package type provides efficient thermal management and compact design, suitable for embedded applications.

Pinout

The MCIMX6L3DVN10AB is a member of the NXP i.MX 6 series of applications processors. It features a pin count of 388 pins.
The primary functions of the MCIMX6L3DVN10AB include:
1. Processing Power: It has a dual-core ARM Cortex-A9 architecture capable of running at speeds up to 1 GHz, designed for high-performance applications.
2. Graphics: Integrated 3D graphics engine and support for 1080p video playback, suitable for multimedia applications.
3. Connectivity: Multiple interfaces including USB, HDMI, Ethernet, and SPI for extensive connectivity options.
4. Memory Support: Capable of interfacing with various memory types, including DDR3 and LPDDR2.
5. Power Management: Features advanced power management capabilities to optimize energy consumption.
These attributes make it suitable for applications in industrial, automotive, and consumer markets.

Manufacturer

The MCIMX6L3DVN10AB is manufactured by NXP Semiconductors, a global semiconductor company. NXP specializes in designing and producing a variety of integrated circuits, microcontrollers, and processors for applications in automotive, industrial, IoT (Internet of Things), and consumer electronics. The i.MX 6 series, which includes the MCIMX6L3DVN10AB, features ARM Cortex-A9 cores and is commonly used in embedded systems for multimedia processing and connectivity. NXP was formed in 2006 as a spin-off from Philips and has since become a key player in the semiconductor industry, focusing on innovation and the development of secure connected solutions.

Application

The MCIMX6L3DVN10AB is a versatile processor commonly used in applications such as industrial automation, automotive systems, medical devices, and consumer electronics. Its low power consumption and robust processing capabilities make it suitable for embedded systems, smart home devices, digital signage, and IoT applications.

Equivalent

The MCIMX6L3DVN10AB is a member of the NXP/Freescale i.MX 6 series. Equivalent products include the i.MX 6Solo (MCIMX6S) and i.MX 6DualLite (MCIMX6DL) chips, which also feature ARM Cortex-A9 processors. For specific applications, consider the i.MX 6Q (Quad) or variants with different performance and power requirements. Always check compatibility, features, and specifications to ensure suitability for your design.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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