MCIMX535DVP1C2

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MCIMX535DVP1C2

IC MPU 32BIT ARM 529PBGA

  • Fabricant
  • Mfr. Partie #MCIMX535DVP1C2
  • Paquet 529-FBGA
  • Fiche de données
  • En stock3789

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Spécifications

Package Tray
Series i.MX53
ProductStatus Active
CoreProcessor ARM® Cortex®-A8
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 1GHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAMControllers LPDDR2, DDR2, DDR3
GraphicsAcceleration Yes
Display&InterfaceControllers Keypad, LCD
Ethernet 10/100Mbps (1)
SATA SATA 1.5Gbps (1)
USB USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage-I/O 1.3V, 1.8V, 2.775V, 3.3V
OperatingTemperature -20°C ~ 85°C (TC)
SecurityFeatures ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package/Case 529-FBGA

Vue d'ensemble

Description

The MCIMX535DVP1C2 is a System on Chip (SoC) developed by NXP Semiconductors, based on the ARM Cortex-A8 architecture. It is designed for multimedia applications and embedded systems, providing a balance of performance, power efficiency, and integration. Key features include support for high-definition video playback, advanced graphics capabilities, and multiple connectivity options like USB, Ethernet, and serial interfaces.
The SoC typically includes a powerful GPU for enhanced graphics processing, making it suitable for applications in automotive, industrial, and consumer electronics. Its architecture supports various operating systems, including Linux and Android, facilitating flexible software development. Overall, the MCIMX535DVP1C2 is widely utilized for building interactive devices that require robust processing capabilities and rich multimedia features.

Features

The MCIMX535DVP1C2 is a System on Chip (SoC) from NXP Semiconductors, designed primarily for applications in multimedia and mobile devices. Key features include:
1. Processor: ARM Cortex-A8 core, operating up to 1 GHz, providing high-performance computing capabilities.
2. Graphics: Integrated 3D graphics accelerator and support for OpenGL ES 2.0, enabling rich visual experiences.
3. Video Support: Capable of 1080p HD video playback and encoding, supporting various video formats.
4. Memory: Supports DDR3/DDR2 memory interfaces for efficient data handling.
5. Connectivity: Built-in interfaces such as USB 2.0, HDMI, SD/MMC, I2C, SPI, and UART for versatile connectivity options.
6. Multimedia: Integrated audio codec support and camera interfaces for enhanced multimedia functionality.
7. Power Management: Features advanced power management capabilities, optimizing energy consumption for mobile applications.
This SoC is suitable for industrial, automotive, and consumer electronics, offering a balance of performance and efficiency.

Package

The MCIMX535DVP1C2 is packaged in a 529-ball FCLGA (Flip-Chip Land Grid Array) package. This package type provides a compact design and is suitable for high-density applications, offering efficient thermal and electrical performance.

Pinout

The MCIMX535DVP1C2 is a part of NXP's i.MX 53 series, specifically designed for embedded applications. It features a total of 289 pins. The device integrates a range of functionalities including a powerful ARM Cortex-A8 core, a 3D graphics accelerator, multimedia support, and various I/O interfaces.
Key functions include:
1. Processor Core: ARM Cortex-A8 up to 1 GHz.
2. Graphics: 3D graphics processing capabilities.
3. Multimedia: Support for video playback and encoding, audio processing.
4. Connectivity: Interfaces such as USB, Ethernet, and serial communication (UART).
5. Memory Support: Interfaces for DDR, NAND, and other memory types.
The pin count and the variety of functionalities make the MCIMX535DVP1C2 suitable for applications in automotive, industrial, and consumer electronics.

Manufacturer

The manufacturer of the MCIMX535DVP1C2 is NXP Semiconductors. NXP is a global semiconductor company known for designing and producing a wide range of microcontrollers, processors, and integrated circuits. The company specializes in automotive, industrial, and Internet of Things (IoT) solutions, as well as secure connectivity and embedded applications. NXP was formed from the spin-off of Philips' semiconductor division and has since become a key player in the electronics industry, focusing on innovation in areas like smart mobility and secure infrastructure.

Application

The MCIMX535DVP1C2 is a multimedia applications processor commonly used in embedded systems. Its application areas include automotive infotainment, consumer electronics, industrial automation, medical devices, and portable handheld devices. It supports high-definition video playback, graphics processing, and real-time data processing, making it suitable for interactive user interfaces and advanced multimedia applications.

Equivalent

The MCIMX535DVP1C2 chip is part of the NXP/Freescale i.MX 53 series. Equivalent products include the i.MX 537, i.MX 6Solo, and i.MX 6DualLite, which offer similar processing capabilities and features for embedded applications. For specific compatibility, always verify the exact specifications and requirements for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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