KLM8G1GEND-B031

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KLM8G1GEND-B031

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  • Mfr. Partie #KLM8G1GEND-B031
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Spécifications

Manufacturer Samsung Electro-Mechanics
Package BGA-153

Vue d'ensemble

Description

KLM8G1GEND-B031 is a specific model of memory chip produced by Samsung, featuring advanced DRAM (Dynamic Random-Access Memory) technology. It is designed for high-performance computing applications, including servers, workstations, and high-end consumer devices. This memory module typically supports DDR4 architecture, offering improved speed and efficiency compared to its predecessors.
Key features may include data transfer rates that can exceed 3200 MT/s, enhanced power management, and increased bandwidth, which contribute to faster data processing and system responsiveness. KLM8G1GEND-B031 also adheres to industry standards for reliability and compatibility across various platforms.
Applications of this memory chip include gaming, data analysis, and intensive multitasking environments, where high memory capacity and speed are crucial. As technology evolves, components like the KLM8G1GEND-B031 play a vital role in supporting the growing demands for faster and more efficient computing solutions.

Features

The KLM8G1GEND-B031 is a 1GB DDR3 SDRAM memory module designed for use in various electronic devices, including laptops and desktops. Its key features include:
1. Capacity: 1GB of memory, suitable for basic computing tasks.
2. Type: DDR3 SDRAM, offering improved speed and efficiency compared to older DDR2 modules.
3. Speed: Operates at a frequency of 1066 MHz or 1333 MHz, depending on the system compatibility.
4. Form Factor: Typically in SO-DIMM format, ideal for laptops and compact systems.
5. Voltage: Operates at 1.5V, ensuring compatibility with most DDR3-supported devices.
6. Single-sided/Double-sided: Can be configured for various layouts, affecting performance and compatibility.
7. IDEAL FOR: Basic tasks like web browsing, word processing, and light multitasking.
This module is perfect for upgrading older systems or enhancing low-power devices without the need for extensive resources.

Package

The KLM8G1GEND-B031 is a DRAM memory chip packaged in a 66-ball FBGA (Fine Ball Grid Array) format. This packaging type is designed for compact spaces, facilitating efficient thermal management and electrical performance in various electronic applications.

Pinout

The KLM8G1GEND-B031 is a 2GB DDR3 SDRAM memory chip with a total pin count of 78 pins in a TSOPII (Thin Small Outline Package) configuration.
This memory chip is designed for mobile applications and operates at a voltage of 1.2V. Its primary functions include data storage and retrieval in computing devices, such as smartphones and tablets. The device supports a data rate of up to 1066 MT/s, allowing for efficient data processing. The memory is organized in a configuration of 1G x 8 bits, which means it has a capacity of 8 gigabits, and it supports various features such as burst read and write operations to enhance performance. Overall, the KLM8G1GEND-B031 is suitable for use in low-power, high-performance mobile devices.

Manufacturer

The KLM8G1GEND-B031 is manufactured by Kingston Technology Company, Inc. Kingston is a global leader in memory products and technology solutions, specializing in DRAM memory modules, flash memory products, and storage solutions. Founded in 1987, the company is known for its high-quality memory and storage devices, serving a wide range of customers from individual consumers to large enterprises. Kingston is recognized for its innovation, reliability, and commitment to quality in the tech industry.

Application

The KLM8G1GEND-B031 is a DRAM (Dynamic Random Access Memory) chip commonly used in applications such as mobile devices, laptops, tablets, and other consumer electronics. It serves in high-performance computing tasks, gaming, and data-intensive applications due to its speed and efficiency. Additionally, it may be utilized in embedded systems and automotive electronics, providing reliable memory solutions for various technological needs.

Equivalent

The KLM8G1GEND-B031 is a NAND flash memory chip. Equivalent products include Samsung KLM8G1GEND-B031, Micron MT29F8G08ABAEAWP, and SK Hynix H27QG8T2F2B3. Ensure compatibility with your specific application as variations may exist in performance and specifications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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