K4ZAF325BM-HC16

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K4ZAF325BM-HC16

16Gbit GDDR6 SGRAM FBGA-180 Memory (ICs) RoHS

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  • Mfr. Partie #K4ZAF325BM-HC16
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  • En stock16814

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Spécifications

Packaging FBGA-180
Memory Format GDDR6 SGRAM
Memory Size 16Gbit

Vue d'ensemble

Description

K4ZAF325BM-HC16 is a specific model of DRAM (Dynamic Random Access Memory) chip produced by Samsung. It is part of the DDR3 (Double Data Rate 3) memory family, which is commonly used in computers and various electronic devices due to its efficiency and performance. The "K4ZAF" designation indicates the manufacturer's code, while "325" typically refers to the capacity (in megabits), which is 256 megabytes for this model. The "BM" indicates the type of package and design, and "HC16" usually refers to the speed grade and voltage specifications. DDR3 memory offers improved bandwidth and power management compared to its predecessor, DDR2, making it suitable for a wide range of applications, including desktops, laptops, and servers. Users looking to integrate or replace this memory chip should ensure compatibility with their motherboard and follow the manufacturer's specifications for optimal performance.

Features

The K4ZAF325BM-HC16 is a 2GB DDR3 SDRAM memory chip produced by Samsung. It features a 1.5V supply voltage, which is standard for DDR3 memory, and operates at data rates of up to 1600 MT/s. This chip is designed for high performance in various applications, including PCs, laptops, and embedded systems. It has a 64-bit data width and is organized as 256M x 8 bits. The K4ZAF325BM-HC16 is built using a 30nm process technology, which enhances energy efficiency and reduces heat generation. Its compact dimensions make it suitable for space-constrained designs. The part is also compliant with JEDEC standards, ensuring compatibility across a broad range of devices. Overall, it delivers reliable performance and efficient power consumption, making it a suitable choice for upgrading memory in compatible systems.

Package

The K4ZAF325BM-HC16 is a DDR3 SDRAM memory chip packaged in a 78-ball TFBGA (Thin Fine Ball Grid Array) format. This packaging allows for efficient heat dissipation and compact design suitable for use in various electronic devices.

Pinout

The K4ZAF325BM-HC16 is a DRAM memory chip from Samsung, specifically a DDR3 SDRAM device. It features a pin count of 78.
In terms of functionality, it operates at a voltage of 1.5V, supporting various data rates and is typically utilized in applications requiring high-performance memory, such as in computers, servers, and other electronic devices. This chip is part of the DDR3 family, which offers improved speed and efficiency compared to previous generations.
Key functions include providing fast access to data, supporting high bandwidth for multitasking, and enhancing overall system performance.

Manufacturer

The K4ZAF325BM-HC16 is manufactured by Samsung Electronics, a South Korean multinational conglomerate. Samsung is primarily known for its consumer electronics, semiconductors, and telecommunications equipment. As one of the largest technology companies in the world, Samsung operates in various sectors, including mobile devices, home appliances, and digital media. The company is particularly recognized for its innovations in memory semiconductor technology, making it one of the leading producers of DRAM and NAND flash memory products, which are essential components in smartphones, tablets, computers, and other electronic devices.

Application

The K4ZAF325BM-HC16 is a 2Gb DDR3 SDRAM memory chip commonly used in applications such as mobile devices, tablets, laptops, and other consumer electronics. Its high-speed performance and energy efficiency make it suitable for gaming consoles and embedded systems. Additionally, it can be utilized in automotive electronics and networking equipment, enhancing data processing capabilities in these devices.

Equivalent

The K4ZAF325BM-HC16 is a DDR3 DRAM chip from Samsung. Equivalent products include:
1. Hynix H5TQ2G83AFR
2. Micron MT41K256M16HA
3. Nanya NT5CB256M16DP
Ensure compatibility in terms of specifications such as voltage, speed, and density when looking for equivalents.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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