K4ZAF325BM-HC14

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K4ZAF325BM-HC14

16Gbit 512M x 32 GDDR6 FBGA-180 Memory (ICs) RoHS

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  • Mfr. Partie #K4ZAF325BM-HC14
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  • Fiche de données
  • En stock27060

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Spécifications

Packaging FBGA-180
Interface GDDR6
Memory Format 512M x 32
Memory Size 16Gbit

Vue d'ensemble

Description

The K4ZAF325BM-HC14 is a high-performance dynamic random-access memory (DRAM) chip designed for use in various electronic devices, including smartphones, tablets, and computers. It typically features a 4GB capacity and operates at a DDR3 standard, allowing for fast data transfer rates and improved energy efficiency. The "HC14" designation indicates specific operational characteristics, including speed and power consumption.
This memory chip is built using advanced manufacturing processes, which enhance its reliability and performance. Its applications range from consumer electronics to industrial systems, where high-speed memory access is crucial. Additionally, the K4ZAF325BM-HC14 is compatible with several system architectures, making it a versatile choice for manufacturers.
Overall, it is an essential component in modern computing, contributing to the overall efficiency and performance of devices that rely on quick and reliable memory access.

Features

The K4ZAF325BM-HC14 is a 4GB DDR3 SDRAM memory module designed for high-performance computing applications. Key features include:
1. Capacity: 4GB, allowing for efficient multitasking and improved performance in memory-intensive applications.
2. Type: DDR3 SDRAM, which offers higher speeds and lower power consumption compared to its predecessor, DDR2.
3. Speed: Typically operates at 1600 MT/s, providing fast data transfer rates essential for modern computing tasks.
4. Form Factor: SO-DIMM, making it suitable for laptops and compact devices.
5. Voltage: Operates at 1.5V, ensuring lower power usage and heat generation.
6. Data Width: 64 bits, contributing to effective data handling and processing.
7. Compatibility: Compatible with a wide range of motherboards that support DDR3 memory, enhancing system versatility.
Overall, the K4ZAF325BM-HC14 is ideal for enhancing the performance of compatible systems, especially in gaming, content creation, and general computing tasks.

Package

The K4ZAF325BM-HC14 is a DRAM chip packaged in a 78-ball BGA (Ball Grid Array) format. This type of packaging facilitates efficient thermal management and space-saving on circuit boards, making it suitable for various electronic applications.

Pinout

The K4ZAF325BM-HC14 is a DRAM memory device, specifically a DDR3 SDRAM. It has a pin count of 78.
The primary functions of this memory chip include:
1. Data Storage: It serves as a volatile memory for temporary storage of data during processing.
2. Memory Access: It allows for read and write operations through various control signals.
3. Input/Output: The pins facilitate data input and output, enabling communication with the memory controller.
4. Power Management: It includes pins for power supply to ensure proper operation.
This memory chip is commonly used in applications such as computer systems, graphics cards, and other electronic devices requiring high-speed data access.

Manufacturer

The K4ZAF325BM-HC14 is manufactured by Samsung Electronics, a leading South Korean multinational company. Samsung Electronics specializes in the production of a wide range of electronic devices and components, including semiconductors, consumer electronics, and telecommunications equipment. It is one of the largest manufacturers of memory chips globally, including DRAM and NAND flash memory, which are critical for various applications in computers, smartphones, and other electronic devices. Samsung is known for its innovation and significant investment in research and development, making it a key player in the technology sector.

Application

The K4ZAF325BM-HC14 is a DDR3 SDRAM memory chip commonly used in applications such as embedded systems, consumer electronics, networking devices, and industrial equipment. It is suited for high-performance tasks requiring reliable data storage and processing, including smartphones, tablets, and laptops. Its efficiency and speed make it ideal for multimedia applications and real-time data processing in various electronic devices.

Equivalent

The K4ZAF325BM-HC14 is a 2GB DDR3 SDRAM chip. Equivalent products include K4B4G0846B-HC14, MT8JTF12864HZ-1G6E1, and Hynix H5TQ2G83AFR. Ensure compatibility in terms of timing, voltage, and density when considering alternatives.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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