K4G80325FC-HC25

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K4G80325FC-HC25

8Gbit GDDR5 SGRAM FBGA-170 Memory (ICs) RoHS

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  • Mfr. Partie #K4G80325FC-HC25
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Spécifications

Packaging FBGA-170
Memory Format GDDR5 SGRAM
Memory Size 8Gbit

Vue d'ensemble

Description

K4G80325FC-HC25 is a type of DRAM (Dynamic Random Access Memory) chip manufactured by Samsung. It is a 1GB DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory) device designed for use in various electronic applications, including computers and embedded systems.
Key specifications typically include a 64-bit data width, a voltage of 1.5V, and support for data rates up to 1600 MT/s (million transfers per second). The "K4G80325" part number indicates its memory architecture, while the "HC25" suffix may refer to specific characteristics such as speed grade or package type.
This memory chip is commonly used in modules such as SO-DIMM for laptops or DIMM for desktops, providing efficient performance and power consumption suitable for modern computing needs. Its reliability and speed make it a popular choice for both consumer electronics and industrial applications.

Features

The K4G80325FC-HC25 is a 256Mb (32MB) DDR3 SDRAM memory chip, produced by Samsung. It features a double data rate architecture, allowing for data transfer rates of up to 1600 Mbps. The chip is organized as 8 bits x 32, enabling it to interface with a variety of applications, particularly in mobile devices and embedded systems.
Key features include:
- Speed Grade: Operates at 1.5V with a frequency of 800 MHz, supporting DDR3-1600.
- Data Transfer: High-speed data transfer with reduced power consumption compared to previous DDR standards.
- Package Type: Available in a 78-ball BGA package, facilitating compact designs.
- Low Power Consumption: Designed for energy efficiency, extending battery life in portable devices.
- Thermal Performance: Enhanced thermal performance for reliability in a range of operating temperatures.
This memory chip is suitable for applications in smartphones, tablets, and other consumer electronics where space and power efficiency are critical.

Package

The K4G80325FC-HC25 is a DRAM memory chip packaged in a 79-ball BGA (Ball Grid Array) format.

Pinout

The K4G80325FC-HC25 is a 256M x 16 bits asynchronous DRAM memory chip from Samsung. It features a total of 48 pins.
The primary functions of the pins include:
- Data Bus: Pins for 16 data lines (DQ0-DQ15) for data input/output.
- Address Lines: Pins for multiplexed address lines (A0-A12) for selecting memory locations.
- Control Signals: Pins such as WE (Write Enable), OE (Output Enable), and CE (Chip Enable) to control read and write operations.
- Power: VDD and VSS pins provide power supply and ground connection.
- Miscellaneous: Additional pins for functions like BA (Bank Address) for bank selection and other control signals.
This memory chip is typically used in various applications requiring high-density memory solutions.

Manufacturer

The K4G80325FC-HC25 is manufactured by Samsung Electronics, a South Korean multinational conglomerate. Samsung is a leading technology company renowned for its diverse range of products, including semiconductors, consumer electronics, and telecommunications equipment. The K4G80325FC-HC25 is a DDR3 DRAM memory chip, primarily used in various electronic devices such as computers, smartphones, and tablets. Samsung is one of the largest manufacturers of memory chips globally, playing a significant role in the semiconductor industry. The company is known for its innovation, advanced research and development capabilities, and commitment to quality in its product offerings.

Application

The K4G80325FC-HC25 is a DRAM memory chip commonly used in various applications, including mobile devices, laptops, and embedded systems. Its high-speed performance and low power consumption make it suitable for consumer electronics, automotive systems, and industrial applications, where efficient data processing and storage are essential.

Equivalent

The K4G80325FC-HC25 is a 256Mb DDR2 SDRAM chip. Equivalent products include the K4G80325FC-HC15 and K4G80325FC-HC4, which offer similar specifications but with different speed grades. Other compatible alternatives may include similar DDR2 chips from manufacturers like Micron, Elpida, or Hynix, as long as they match the capacity, package type, and timing specifications. Always check datasheets for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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