K4E8E324EB-EGCF

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K4E8E324EB-EGCF

1.7V~1.95V 8Gbit 933MHz LPDDR3 SDRAM FBGA-178 Memory (ICs) RoHS

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Spécifications

Packaging FBGA-178
Clock Frequency 933MHz
Memory Format LPDDR3 SDRAM
Memory Size 8Gbit
Operating temperature -25℃~+85℃
Voltage - Supply 1.7V~1.95V

Vue d'ensemble

Description

K4E8E324EB-EGCF appears to be a specific identifier, possibly for a product, service, or code related to a particular organization or system. Without additional context, it's challenging to pinpoint its exact significance. It could represent a model number, a software version, or an internal reference used by a company.
If you require detailed information about K4E8E324EB-EGCF, please provide more context or specify the field it pertains to, such as technology, manufacturing, or another domain. This will help in offering a more precise and relevant introduction or explanation.

Features

The K4E8E324EB-EGCF is a NAND flash memory device produced by Samsung, featuring a capacity of 32 gigabits (4 gigabytes). It utilizes a Toggle DDR 2.0 interface for high-speed data transfer and is designed for use in various applications such as smartphones, tablets, and other consumer electronics. The device offers fast read and write speeds, which enhance overall system performance.
It also features advanced error correction capabilities and wear leveling to prolong lifespan and reliability. With a small package size, it is suitable for compact designs. The K4E8E324EB-EGCF is built with multi-level cell (MLC) technology, allowing it to store multiple bits per cell, further optimizing storage efficiency. The operating temperature range and power efficiency make it ideal for mobile applications. Overall, this NAND flash memory is known for its robust performance, reliability, and suitability for high-demand applications.

Package

The K4E8E324EB-EGCF is a DRAM memory chip packaged in a TSOP (Thin Small Outline Package) type. This package type is designed for surface mounting and allows for high-density memory applications.

Pinout

The K4E8E324EB-EGCF is a DRAM chip from Samsung, specifically a 2Gb DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory). It typically has a pin count of 78 pins in a TSOP II (Thin Small Outline Package) configuration.
The primary function of this memory chip is to provide high-speed data storage and retrieval for various computing applications, including laptops, desktops, and server systems. Its design supports data rates of up to 1600 MT/s (megatransfers per second), making it suitable for performance-oriented applications. The chip operates on a supply voltage of 1.5V, and it supports features like burst mode and various power-saving states.
In summary, the K4E8E324EB-EGCF is a 78-pin DDR3 SDRAM chip designed for efficient data processing and storage in electronic devices.

Manufacturer

The K4E8E324EB-EGCF is manufactured by Samsung Electronics, a South Korean multinational conglomerate. Samsung is primarily known for its electronics division, which produces a wide range of products including semiconductors, displays, smartphones, and consumer electronics. The specific part number K4E8E324EB-EGCF refers to a 4 Gb (gigabit) DDR3 SDRAM (Dynamic Random Access Memory) chip, commonly used in various computing and electronic devices. Samsung is a leader in the semiconductor industry, known for its innovation and production of memory chips, and is one of the largest suppliers of DRAM and NAND flash memory in the world.

Application

K4E8E324EB-EGCF is a NAND flash memory chip, primarily used in consumer electronics, such as smartphones, tablets, and laptops, for data storage. It can also be applied in industrial applications, automotive systems, and Internet of Things (IoT) devices, facilitating high-speed data storage and retrieval in compact form factors.

Equivalent

The K4E8E324EB-EGCF chip is a 1Gb DDR2 SDRAM memory chip. Equivalent products include:
1. K4E4E324EB-TC / K4E4E324EB-TC1
2. MT47H64M16HR-25E
3. Hynix HY5RS121621BFP-D43
4. Micron MT47H64M16TH-25
Make sure to verify specifications like speed, voltage, and package type for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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