K4ABG085WA-MCWE

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K4ABG085WA-MCWE

32Gbit 1.2V 1.6GHz DDR4 SDRAM FBGA-78 Memory (ICs) RoHS

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Spécifications

Packaging FBGA-78
Clock Frequency 1.6GHz
Memory Format DDR4 SDRAM
Memory Size 32Gbit
Operating temperature 0℃~+85℃
Voltage - Supply 1.2V

Vue d'ensemble

Description

K4ABG085WA-MCWE is a specific type of DRAM (Dynamic Random Access Memory) module designed for high-performance computing applications. It typically features an 8GB capacity and operates at a voltage of 1.2V, making it suitable for energy-efficient systems. This memory module is commonly used in laptops, desktops, and servers, providing fast data access speeds essential for multitasking and demanding applications.
The "MCWE" designation often indicates specific characteristics such as the memory’s architecture or packaging type. The module is built to comply with industry standards, ensuring compatibility with a variety of motherboards and devices. Overall, K4ABG085WA-MCWE is aimed at users seeking reliable and efficient memory solutions to enhance computing performance.

Features

The K4ABG085WA-MCWE is a NAND flash memory chip designed for high-performance applications. Key features include:
1. Capacity: 8 Gb (Gigabits), suitable for various embedded systems.
2. Interface: Supports ONFI (Open NAND Flash Interface) for seamless integration and compatibility with various controllers.
3. Speed: High data transfer rates, enhancing read and write performance, ideal for applications requiring quick access to data.
4. Endurance: Designed for high endurance, accommodating a significant number of program/erase cycles, making it suitable for demanding tasks.
5. Low Power Consumption: Optimized for energy efficiency, making it ideal for battery-powered devices.
6. Reliability: Features error correction codes (ECC) to ensure data integrity and reliability over time.
7. Package: Available in a compact package, allowing for space-efficient designs in consumer electronics and industrial applications.
Overall, the K4ABG085WA-MCWE is engineered for versatility and performance in a variety of electronic applications.

Package

The K4ABG085WA-MCWE is packaged in a 200-ball FBGA (Fine Ball Grid Array) format. This package type is designed for high-density applications, providing a compact footprint and efficient thermal dissipation for memory devices.

Pinout

The K4ABG085WA-MCWE is a mobile DRAM (Dynamic Random Access Memory) device manufactured by Samsung. It features a 78-ball FBGA (Fine Ball Grid Array) package. The pin count is 78 balls, which provide various functions including data input/output, power supply, ground, and control signals. The specific functions of the pins typically include:
- Data Lines (DQ): For data input and output.
- Address Lines (A): For addressing memory locations.
- Control Signals (CK, CS, WE, etc.): To control the read/write operations and chip selection.
- Power Supply (VDD, VSS): For supplying power to the device.
This DRAM is commonly used in mobile applications due to its low power consumption and high performance.

Manufacturer

The K4ABG085WA-MCWE is manufactured by Samsung Electronics. Samsung is a South Korean multinational conglomerate known for its diverse range of products and services, including consumer electronics, semiconductors, telecommunications, and home appliances. The company is one of the largest producers of memory chips, displays, and smartphones in the world. Samsung operates in various sectors, focusing on innovation and technology, and is recognized for its contributions to advancements in electronics and digital technologies.

Application

The K4ABG085WA-MCWE is a NAND flash memory device primarily used in applications such as smartphones, tablets, and other consumer electronics for data storage. It also finds use in automotive systems, industrial applications, and portable devices, where reliable, high-performance storage solutions are essential. Its features support fast data transfer and efficient power consumption, making it suitable for a variety of embedded applications.

Equivalent

The K4ABG085WA-MCWE chip is a 1GB DRAM component. Equivalent products include Samsung K4B4G0856B-HC, Micron MT47H256M8, and Hynix H5TQ1G83AFR. Ensure to check specifications like voltage, package type, and timings for compatibility in your application.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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