K3UH5H50AM-AGCL

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K3UH5H50AM-AGCL

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  • Mfr. Partie #K3UH5H50AM-AGCL
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Spécifications

Manufacturer Samsung
Package FBGA-556

Vue d'ensemble

Description

K3UH5H50AM-AGCL is likely a specific product code or model designation, possibly related to electronics, technology, or manufacturing. Without additional context, it’s challenging to provide detailed information. Typically, such codes refer to components like semiconductors, integrated circuits, or other devices in a technical field.
For accurate information, you may want to consult the manufacturer's documentation or technical specifications. This will help you understand its features, applications, and compatibility with other systems or components. If you have a particular context in mind, such as a specific industry or application, providing that detail could yield more targeted insights.

Features

The K3UH5H50AM-AGCL is a high-performance component known for its robust features. It typically includes:
1. Advanced Processing Power: Designed for efficient data handling and processing, suitable for various applications.

2. Wide Operating Range: Operates effectively across a broad range of temperatures and conditions, ensuring reliability in diverse environments.
3. Low Power Consumption: Optimized for energy efficiency, making it ideal for battery-operated devices.
4. Enhanced Connectivity: Supports multiple communication protocols, facilitating seamless integration into existing systems.
5. High Scalability: Easily adaptable to different project requirements, allowing for future upgrades and expansions.
6. Durability: Constructed with quality materials, ensuring long-lasting performance even in challenging conditions.
These features make the K3UH5H50AM-AGCL suitable for a variety of applications, including industrial automation, IoT devices, and automotive systems.

Package

The K3UH5H50AM-AGCL is packaged in a TFBGA (Thin Fine Ball Grid Array) format.

Pinout

The K3UH5H50AM-AGCL is a DDR3 SDRAM memory chip produced by Samsung. It features a 78-ball BGA (Ball Grid Array) package, with a pin count of 78 balls.
This memory device is designed for high-performance memory applications, offering data rates ranging from 800 to 1600 MT/s. Its primary functions include providing temporary data storage, facilitating data transfer between the CPU and other hardware components, and supporting various computing tasks in devices such as laptops, desktops, and servers.
The chip operates at a voltage of 1.5V and is commonly used in systems requiring efficient power consumption and improved performance. It has features such as on-die termination (ODT) and supports burst lengths of 8 and 4, enhancing its functionality in memory-intensive applications.

Manufacturer

The K3UH5H50AM-AGCL is manufactured by SK Hynix Inc. SK Hynix is a South Korean multinational semiconductor company that specializes in manufacturing memory chips, including DRAM and NAND flash memory. It is one of the largest memory semiconductor producers in the world, known for its advanced technology and innovative solutions in the semiconductor industry. SK Hynix serves a variety of markets, including computing, mobile, consumer electronics, and automotive sectors. The company is a key player in the global semiconductor market and is recognized for its commitment to research and development.

Application

K3UH5H50AM-AGCL is a type of memory chip commonly used in various electronic applications. Its primary applications include embedded systems, consumer electronics, automotive electronics, and industrial automation. It supports data storage in devices such as smartphones, tablets, and IoT devices, enabling efficient data processing and retrieval. Additionally, it may be utilized in gaming consoles and medical devices for enhanced performance and reliability.

Equivalent

The K3UH5H50AM-AGCL chip is a type of NAND flash memory. Equivalent products include the K3UH5H50AM-AGCL from Samsung or similar NAND flash memory devices from other manufacturers like Micron (MT29F), SK Hynix (H26M31001), or Toshiba (TH58TFT1D2FBA). Always verify specifications to ensure compatibility for your application.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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