IS29GL256-70SLEB

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IS29GL256-70SLEB

IC FLASH 256MBIT PAR 56TSOP I

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Spécifications

Package Tray
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NOR
MemorySize 256Mb (32M x 8)
MemoryInterface Parallel
WriteCycleTime-WordPage 200µs
AccessTime 70 ns
Voltage-Supply 2.7V ~ 3.6V
OperatingTemperature -40°C ~ 105°C (TA)
MountingType Surface Mount
Package/Case 56-TFSOP (0.724, 18.40mm Width)

Vue d'ensemble

Description

The IS29GL256-70SLEB is a 256 Megabit (32 Megabytes) NOR Flash memory device manufactured by Integrated Silicon Solution, Inc. (ISSI). It features a 70 ns access time, making it suitable for high-speed applications. The memory is organized in a 16-bit wide format and supports a wide range of programming and erasing options, including 8-byte programming and sector-based erasure.
This device operates on a single 3V power supply and provides a range of interfaces, making it compatible with various microcontrollers and processors. It includes features like uniform block architecture, hardware protection, and an array of command sets to facilitate ease of use.
The IS29GL256-70SLEB is ideal for applications such as embedded systems, automotive, telecommunications, and consumer electronics, where reliable and fast flash memory is required. It is housed in a 44-pin TSOP package, ensuring compact integration into designs.

Features

The IS29GL256-70SLEB is a 256 Mb (32 MB) NOR Flash memory device featuring the following key attributes:
1. Memory Density: 256 Mb, organized as 32M x 8 bits or 16M x 16 bits.
2. Access Speed: Offers a maximum access time of 70 ns.
3. Interface: Parallel interface with easy integration into microcontroller systems.
4. Voltage Range: Operates with a supply voltage of 2.7V to 3.6V for reading and programming.
5. Endurance: Supports a minimum of 100,000 program/erase cycles.
6. Data Retention: Ensures data retention of 20 years or more at 85°C.
7. Program/Erase Features: Supports sector erase and page programming for efficient memory management.
8. Low Power Consumption: Designed for low power operation, suitable for battery-powered applications.
9. Security Features: Includes features like chip erase and protection against accidental writes.
This device is ideal for applications in consumer electronics, automotive, and industrial systems requiring reliable non-volatile storage.

Package

The IS29GL256-70SLEB is packaged in a TSOP (Thin Small Outline Package) type, specifically in a 48-pin configuration. This package type is designed for surface mounting, making it suitable for compact electronic applications.

Pinout

The IS29GL256-70SLEB is a 256Mb (32MB) NOR Flash memory device. It has a total of 48 pins.
Pin Functions:
1. Address Pins (A0-A21): Used to select memory locations.
2. Data Pins (DQ0-DQ15): Bi-directional data bus for reading and writing data.
3. Control Pins:
- Chip Enable (CE): Enables the device for operation.
- Write Enable (WE): Controls write operations.
- Output Enable (OE): Enables output during read operations.
4. Reset (RESET): Resets the device.
5. VCC: Power supply.
6. GND: Ground connection.
7. Byte/Word (B/W): Selects data bus width (byte or word).
8. A-1 to A18: Address lines for accessing memory.
The device supports asynchronous read and write operations, making it suitable for a variety of applications in consumer and industrial electronics.

Manufacturer

The IS29GL256-70SLEB is manufactured by Integrated Silicon Solution, Inc. (ISSI). ISSI is a semiconductor company that specializes in the design and production of high-performance memory products, including SRAM, DRAM, and Flash memory solutions. Founded in 1988, ISSI is known for its focus on high-quality and reliable memory solutions for various applications, including automotive, industrial, and consumer electronics. The company's products are widely used in systems that require fast data access and retention, making them integral to modern electronic devices.

Application

The IS29GL256-70SLEB is a 256Mb NOR Flash memory device primarily used in embedded systems. Its application areas include consumer electronics, automotive systems, industrial control, telecommunications, and networking equipment. It is ideal for code storage, firmware updates, and data logging due to its fast read speeds and reliable performance in various environments.

Equivalent

Equivalent products for the IS29GL256-70SLEB chip include the Micron MT29F256G08CBABAWP and the Winbond W25Q256JV. These alternatives offer similar specifications in terms of storage capacity and interface compatibility (SPI, NAND). Always verify package types and voltage levels before substitution.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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