IR2302STRPBF

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IR2302STRPBF

IC GATE DRVR HALF-BRIDGE 8SOIC

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Spécifications

Package Tape & Reel (TR)
ProductStatus Active
DrivenConfiguration Half-Bridge
ChannelType Synchronous
NumberofDrivers 2
GateType IGBT, N-Channel MOSFET
Voltage-Supply 5V ~ 20V
LogicVoltage-VILVIH 0.8V, 2.9V
Current-PeakOutput(SourceSink) 200mA, 350mA
InputType Non-Inverting
HighSideVoltage-Max(Bootstrap) 600 V
Rise/FallTime(Typ) 130ns, 50ns
OperatingTemperature -40°C ~ 150°C (TJ)
MountingType Surface Mount
Package/Case 8-SOIC (0.154, 3.90mm Width)

Vue d'ensemble

Description

The IR2302STRPBF is a type of integrated circuit, specifically a high-speed power MOSFET and IGBT driver. It is produced by Infineon Technologies, a major manufacturer in the semiconductor industry. This device is used to drive power MOSFETs and IGBTs in high-frequency applications, providing the necessary gate drive voltage and current to ensure efficient switching.
Key features of the IR2302STRPBF include:
1. Half-Bridge Driver: It is designed to drive a half-bridge configuration, which is commonly used in inverter and motor control applications.
2. Under-Voltage Lockout (UVLO): The device includes protection features like UVLO to safeguard against low-voltage conditions, ensuring reliable operation.
3. Bootstrap Circuitry: It supports bootstrap circuitry, which allows for the generation of the high-side drive voltage.
4. High-Speed Operation: The IC supports fast switching speeds, which are essential for efficient power conversion.
5. Compact and Efficient: It is packaged in a small form factor, making it suitable for space-constrained applications.
The IR2302STRPBF is widely used in applications such as motor drives, industrial inverters, and power supplies due to its reliability and efficiency in driving power transistors.

Features

The IR2302STRPBF is a high-voltage, high-speed power MOSFET and IGBT driver. It features:
1. Dual Output Channels: Capable of driving both high-side and low-side power MOSFETs or IGBTs.
2. High Voltage Range: Designed to work with high-voltage applications, supporting up to 600V.
3. Bootstrap Circuitry: Integrated bootstrap diodes support the high-side driver, facilitating efficient switching.
4. High-Speed Operation: Capable of fast switching speeds, enhancing the efficiency of power conversion.
5. Undervoltage Lockout (UVLO): Provides protection by preventing the gate driver from operating when the supply voltage is too low.
6. Low Propagation Delay: Ensures quick response times, which are crucial for high-frequency applications.
7. CMOS Schmitt-triggered Inputs: Offers better noise immunity, ensuring stable operation in noisy environments.
8. Logic-level Compatibility: Compatible with standard logic-level inputs, simplifying integration into various systems.
9. Thermal Protection: Built-in features to protect against overheating, increasing the reliability and lifespan of the device.
10. Compact Packaging: Available in SOIC-8 package, optimizing space-saving for PCB designs.
These features make the IR2302STRPBF suitable for various applications, including motor drives, power supplies, and inverter systems.

Package

The IR2302STRPBF is housed in an SOIC-8 package, which is a small-outline integrated circuit with 8 pins. This package type is commonly used for surface-mounted devices, providing a compact and reliable form factor for various electronic applications.

Pinout

The IR2302STRPBF is a high-voltage, high-speed power MOSFET and IGBT driver with independent high and low side referenced output channels. It is typically used for driving half-bridge configurations in various applications.
The IR2302STRPBF comes in an 8-pin configuration. Here's a brief overview of its pin functions:
1. VCC: Supply voltage for the IC.
2. VB: High-side floating supply voltage.
3. HO: High-side output, connected to the gate of the high-side MOSFET or IGBT.
4. HS: High-side source connection, used as the return path for the high-side driver.
5. VS: Return path for input logic signals. Connects the logic ground.
6. HIN: Logic input for controlling the high-side output.
7. LIN: Logic input for controlling the low-side output.
8. LO: Low-side output, connected to the gate of the low-side MOSFET or IGBT.
9. COM: Common ground for the low-side driver.
This configuration allows for independent control of the high and low-side switches in half-bridge applications, making it suitable for a wide range of power electronics applications.

Manufacturer

The IR2302STRPBF is manufactured by Infineon Technologies. Infineon is a global semiconductor company that designs, manufactures, and markets a broad range of semiconductors and system solutions. Their products are used in automotive, industrial power control, power management & multimarket, and digital security solutions. Infineon is known for its focus on energy efficiency, mobility, and security, aiming to address key challenges in these areas through its innovations.

Application

The IR2302STRPBF is a high-voltage gate driver IC used primarily in applications requiring efficient switching of power MOSFETs or IGBTs. It is commonly utilized in motor control systems, power supply units, inverters, and industrial automation equipment. The device offers features such as high-speed operation, under-voltage lockout, and protection mechanisms, making it suitable for enhancing the performance and reliability of power electronics systems.

Equivalent

The IR2302STRPBF is a high and low side driver from Infineon Technologies. Equivalent products include:
1. IRS2302STRPBF (Infineon, similar functionality with potential variations in packaging or slight specs).
2. FAN7390 (ON Semiconductor, similar function and performance).
3. MIC4101 (Microchip Technology, similar high/low side MOSFET driver).
4. LM5101 (Texas Instruments, similar half-bridge driver).
Ensure to compare electrical characteristics and package specifications before substituting.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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