HPP845E031R4

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HPP845E031R4

SENSOR HUMID/TEMP 3V I2C 2% SMD

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Spécifications

Series HTU
Part Status Active
Sensor Type Humidity, Temperature
Humidity Range 0 ~ 100% RH
Output Type I2C
Output 12b
Accuracy ±2% RH
Response Time 5 s
Voltage - Supply 1.5V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C
Package / Case 6-VDFN Exposed Pad
Supplier Device Package 6-DFN (3x3)
Base Product Number HPP845

Vue d'ensemble

Description

HPP845E031R4 is a specific model of an HPP (High-Performance Polymer) product, likely used in fields requiring advanced materials, such as automotive, aerospace, or electronics. These polymers are typically characterized by their high thermal stability, chemical resistance, and mechanical strength.
The designation “E031” may refer to specific formulation or properties related to this polymer, while “R4” could indicate a particular grade or variant. Such materials are often utilized for applications that demand reliability under extreme conditions.
For precise details on HPP845E031R4, including specifications, applications, and processing methods, consulting the manufacturer's technical datasheet or product information is recommended.

Features

The HPP845E031R4 is a high-performance, low-profile power inductor designed for applications requiring efficient power management. Key features include:
1. Inductance Value: Typically around 3.1 µH, allowing for effective energy storage in DC-DC converters and filter applications.
2. Rated Current: Handles high saturation currents, making it suitable for demanding applications.
3. Low DC Resistance: Minimizes power losses, enhancing efficiency.
4. Compact Size: The low-profile design enables integration into space-constrained applications, such as mobile devices and wearables.
5. Temperature Stability: Maintains performance across a range of temperatures, ensuring reliability in various operating conditions.
6. Shielded Construction: Reduces electromagnetic interference (EMI), making it ideal for high-frequency applications.
Overall, the HPP845E031R4 is optimized for efficiency, compactness, and performance, making it a popular choice in modern electronic designs.

Package

The HPP845E031R4 is typically packaged in a TSOP (Thin Small Outline Package) format. This compact package type is designed for efficient space usage and thermal management in electronic devices.

Pinout

The HPP845E031R4 is a high-performance power management IC used in various applications, including computing and consumer electronics. It typically features a pin count of 32 pins, although the exact number may vary based on the specific packaging and configuration.
The primary functions of the HPP845E031R4 include voltage regulation, power sequencing, and thermal management. It integrates multiple power outputs, allowing it to supply different voltage levels required by various components in a system. Additionally, it supports features like overcurrent protection, under-voltage lockout, and programmable power-up sequencing to enhance system reliability and efficiency.
For precise details on pin configuration and specifications, it is essential to refer to the manufacturer's datasheet.

Manufacturer

The HPP845E031R4 is a product manufactured by Himax Technologies, Inc. Himax is a Taiwanese company known for its development and supply of display drivers and other semiconductor solutions primarily for consumer electronics, such as smartphones, tablets, and televisions. The company specializes in imaging processing and driver ICs, and it plays a significant role in the display technology market, offering products that enable high-quality visual experiences in various applications. In addition to display drivers, Himax also ventures into other areas such as touch panel controllers and automotive solutions.

Application

HPP845E031R4 is commonly used in automotive and industrial applications, particularly in power management and control systems. Its features make it suitable for high-performance computing, motor control, and DC-DC conversion in electric vehicles, renewable energy systems, and other electronic devices requiring efficient power handling and thermal management.

Equivalent

The HPP845E031R4 chip is a specific part number that may not have many direct equivalents. However, potential equivalents can include similar memory or processing chips from manufacturers like Intel, AMD, or other semiconductor companies. To find exact equivalents, consider specifications such as architecture, pin configuration, power requirements, and intended application. For accurate replacements, consult the manufacturer’s datasheets or use electronic component databases.

Expédition

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offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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