H3LIS200DL

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H3LIS200DL

ACCEL 100-200G I2C/SPI 16TFLGA

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Spécifications

Part Status Active
Type Digital
Axis X, Y, Z
Acceleration Range ±100g, ±200g
Sensitivity (LSB/g) 1 (±100g) ~ 0.6 (±200g)
Bandwidth 25Hz ~ 500Hz
Output Type I2C, SPI
Voltage - Supply 2.16V ~ 3.6V
Features Selectable Scale
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 16-VFLGA
Supplier Device Package 16-TFLGA (3x3)
Base Product Number H3LIS200

Vue d'ensemble

Description

H3LIS200DL is a course designed to introduce students to the foundational concepts of Human-Computer Interaction (HCI) and Human-Computer Interface design. It focuses on understanding user needs, behavior, and the principles of usability in technology. The curriculum typically covers topics such as user research methods, interface design principles, usability testing, and the importance of user-centered design.
Students learn to analyze and evaluate existing interfaces and to apply design thinking to create effective and engaging user experiences. The course often involves hands-on projects, allowing students to apply theoretical knowledge in practical scenarios. Additionally, it may explore emerging technologies and their implications for HCI, preparing students for advancements in the field. Overall, H3LIS200DL equips learners with essential skills to enhance interaction between humans and digital systems.

Features

The H3LIS200DL is a low-power, 3-axis digital accelerometer designed for various applications, including mobile devices, gaming, and motion sensing. Key features include:
1. Measurement Range: Offers selectable full-scale ranges of ±2g, ±4g, ±8g, and ±16g.
2. Digital Output: Communicates via I²C and SPI interfaces for easy integration with microcontrollers.
3. Low Power Consumption: Operates with low power, making it suitable for battery-operated devices.
4. Built-in FIFO: Features a 32-level FIFO buffer for storing acceleration data, enhancing efficiency in data handling.
5. Embedded Functions: Includes functions for gesture recognition, free fall detection, and tap detection, enhancing user interaction.
6. Temperature Sensor: Integrates a temperature sensor for environmental monitoring.
7. Compact Package: Housed in a small LGA (Land Grid Array) package, facilitating straightforward mounting in space-constrained applications.
These features make the H3LIS200DL versatile for various industrial, consumer, and automotive applications.

Package

The H3LIS200DL is typically available in a 3x3x1 mm LGA (Land Grid Array) package. This compact package design makes it suitable for various applications requiring space-efficient and high-performance accelerometer sensors.

Pinout

The H3LIS200DL is a tri-axis accelerometer featuring a 12-pin LGA (Land Grid Array) package. Its pin configuration includes:
1. VDD: Power supply.
2. GND: Ground connection.
3. SDA: Serial data line for I2C communication.
4. SCL: Serial clock line for I2C communication.
5. CS: Chip select for SPI mode (active low).
6. SDO: Serial data output for SPI communication.
7. SDI: Serial data input for SPI communication.
8. INT1: Interrupt output 1.
9. INT2: Interrupt output 2.
10. XOUT: X-axis output (analog).
11. YOUT: Y-axis output (analog).
12. ZOUT: Z-axis output (analog).
The H3LIS200DL is designed for applications requiring motion detection, tilt sensing, and free-fall detection, with a measurement range of ±2g/±8g and an I2C/SPI interface for communication.

Manufacturer

The H3LIS200DL is manufactured by STMicroelectronics, a global semiconductor company. STMicroelectronics specializes in the design and production of a wide range of semiconductor solutions, including sensors, microcontrollers, and integrated circuits. The company serves various industries such as automotive, industrial, consumer electronics, and telecommunications. Founded in 1987, STMicroelectronics is known for its innovation and commitment to sustainability, providing advanced technology for a connected world.

Application

The H3LIS200DL is a digital accelerometer used in various applications, including mobile phones, wearable devices, automotive systems, and industrial machinery. It enables motion sensing for features like orientation detection, activity tracking, and vibration analysis. Additionally, it is utilized in gaming, robotics, and health monitoring systems to provide precise motion data.

Equivalent

Equivalent products to the H3LIS200DL chip include the STMicroelectronics LIS2DH, LIS3DH, and LIS2DW12 accelerometers. Other alternatives may include the Bosch BMA250 and BMA255 sensors. Always check the specific specifications and features to ensure compatibility for your application.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire