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H27U4G8F2DTR-BC
- Fabricant
- Mfr. Partie #H27U4G8F2DTR-BC
- Paquet
- Fiche de données
- En stock5446
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Spécifications
| Manufacturer | JLCPCB Assembly |
| Package | TSOP1-48 |
Vue d'ensemble
Description
In many cases, such codes are used by manufacturers to identify specific models and configurations of their products. For example, memory chips from companies like Samsung, Hynix, or Micron often have similar alphanumeric codes indicating specifications like memory size, type (e.g., NAND, DRAM), speed, and package type.
For an accurate introduction, you would typically refer to the manufacturer's datasheet or product documentation for the H27U4G8F2DTR-BC. This documentation would provide details such as its electrical characteristics, pin configuration, operational guidelines, and application scenarios.
If you need specific information about this product code, I recommend visiting the manufacturer's website or consulting their technical support for official details.
Features
1. Memory Capacity: Typically offers 32Gb (Gigabit) of storage.
2. Type: It is a Synchronous NAND Flash, which provides efficient data transfer speeds.
3. Voltage: Operates at a low voltage, around 3.3V, making it energy-efficient.
4. Interface: Utilizes a standard interface for compatibility with various controllers.
5. Endurance: Designed to withstand a high number of program/erase cycles, suitable for applications requiring frequent data rewriting.
6. Performance: Offers fast read and write speeds, enhancing overall device performance.
7. Form Factor: Comes in a compact package, making it ideal for space-constrained applications.
8. Temperature Range: Supports a wide operating temperature range, suitable for diverse environments.
9. Reliability: Features error correction mechanisms to ensure data integrity.
This chip is typically used in consumer electronics, mobile devices, and other applications where high-density, non-volatile memory is required.
Package
Pinout
Key functions of the pins include:
- Power Supply Pins: VCC and GND for providing power to the device.
- Data Interface Pins: I/O pins for data input and output operations.
- Control Pins: Include CLE (Command Latch Enable), ALE (Address Latch Enable), WE# (Write Enable), RE# (Read Enable), and CE# (Chip Enable) for managing the operations of the NAND flash.
- R/B# (Ready/Busy): Indicates the status of the memory operation.
The H27U4G8F2DTR-BC is designed to offer high-density storage with reliable performance, making it suitable for various digital storage applications. Always refer to the manufacturer's datasheet for detailed pin configuration and functions.
Manufacturer
Application
Equivalent
1. Samsung: K9GAG08U0F series
2. Micron: MT29F4G08ABADAWP series
3. Toshiba (now Kioxia): TC58NVG2S3HTA00 series
Ensure compatibility by checking specifications like capacity, voltage, interface, and package type, as they may vary slightly across manufacturers.
Expédition
Méthodes d'expéditionNous
offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.
Référence des frais d'expédition (DHL/FedEx):
DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.
FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.
Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.
Paiements
Payment Methods
Le terme de paiement est 100% prépayé.
Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:
1. PayPal
2. Carte de crédit/débit
3. Transfert bancaire
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