H27U1G8F2BTR-BC

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H27U1G8F2BTR-BC

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  • Mfr. Partie #H27U1G8F2BTR-BC
  • Paquet
  • Fiche de données
  • En stock29009

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Spécifications

Manufacturer JLCPCB Assembly
Package TSOP-I48

Vue d'ensemble

Description

H27U1G8F2BTR-BC is a type of NAND Flash memory produced by Hyundai. It is designed for use in various electronic devices, including smartphones, tablets, and other consumer electronics. This specific model typically features a capacity of 1GB and is built on a multi-level cell (MLC) technology, which allows for storing multiple bits of data per cell.
The "H27" prefix indicates the manufacturer, while the "U1" denotes the product series. The "G8F2" suggests the memory's architecture, and "BTR-BC" could refer to specific packaging or configuration details. This memory is known for its reliability and speed, making it suitable for applications requiring fast data access and storage.
Overall, the H27U1G8F2BTR-BC serves as a crucial component in enhancing the performance and efficiency of modern electronic devices.

Features

The H27U1G8F2BTR-BC is a NAND flash memory chip from Hyundai, typically featuring the following characteristics:
1. Type: NAND Flash Memory
2. Density: 1 Gigabit (Gb)
3. Interface: Parallel interface
4. Voltage: Operates at 3.3V, suitable for low-power applications.
5. Cell Structure: Supports SLC (Single-Level Cell) or MLC (Multi-Level Cell) configurations, enhancing performance and reliability.
6. Speed: Offers high read and write speeds, making it suitable for fast data processing.
7. Endurance: Designed for improved endurance and reliability in various applications.
8. Packaging: Available in various package types, typically BGA (Ball Grid Array), for efficient integration into devices.
This chip is ideal for use in consumer electronics, automotive applications, and embedded systems requiring reliable and efficient storage solutions.

Package

The H27U1G8F2BTR-BC is packaged in a TSOP (Thin Small Outline Package) form factor. This type of packaging is commonly used for memory devices, offering a compact design suitable for various electronic applications.

Pinout

The H27U1G8F2BTR-BC is a NAND flash memory device with a pin count of 48 pins. This component is part of the 1 Gb (gigabit) NAND flash family and utilizes a TSOP (Thin Small Outline Package) form factor.
The primary functions of this device include data storage, enabling non-volatile memory applications in various electronic devices. It supports features such as page programming, block erasing, and random access. The H27U1G8F2BTR-BC is designed for use in applications like solid-state drives (SSDs), USB flash drives, and embedded systems.
Key specifications include a synchronous interface, enabling high-speed data transfer, and the ability to handle multiple read and write operations efficiently. Overall, it is tailored for applications requiring reliable and high-density data storage solutions.

Manufacturer

The H27U1G8F2BTR-BC is manufactured by Hyundai Electronics, a division of Hyundai Motor Group. Hyundai Electronics specializes in producing semiconductor products, including DRAM, NAND flash memory, and various other memory chips. As a major player in the global semiconductor market, the company focuses on technological innovation and high-quality products to meet the demands of various industries, including consumer electronics, automotive, and telecommunications. The company's commitment to research and development positions it as a significant contributor to advancements in memory technology.

Application

The H27U1G8F2BTR-BC is a NAND flash memory chip used in various applications, including smartphones, tablets, and consumer electronics. It serves in data storage for embedded systems, automotive applications, industrial devices, and SSDs (Solid-State Drives). Its high-density storage capacity and reliability make it suitable for applications requiring fast read/write speeds and robust data retention.

Equivalent

The H27U1G8F2BTR-BC is a 1Gb NAND Flash memory chip. Equivalent products include:
1. H27U1G8F2BTR-BA
2. MT29F1G08ABAEAWP
3. K9GAG08U0M
4. W29N01HVZEIR
Ensure compatibility with your specific application, as variations may exist in voltage, speed, or memory organization.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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