H26M52208FPR

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H26M52208FPR

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Spécifications

Manufacturer SK HYNIX
Package FBGA-153
Memory Size 16GB
Operating Temperature -25℃~+85℃
Voltage - Supply 2.7V~3.6V
Interface eMMC 5.1
Sequential Read/Write (MB/s) 280/70 MB/s
Random Read/Write (IOPS) 6.5K/12K iops

Vue d'ensemble

Description

H26M52208FPR is a type of NAND flash memory chip designed for storage applications. This specific model typically features a 512MB capacity, providing a reliable solution for consumer electronics, embedded systems, and various computing applications. The chip operates at low voltage, enhancing power efficiency, which is critical for battery-powered devices. It utilizes a serial interface for data communication, facilitating easy integration into different hardware platforms.
H26M52208FPR is part of a broader family of flash memory products known for their high performance and durability. These chips are suited for tasks requiring quick data access and storage, such as in smartphones, tablets, and industrial applications. Its design emphasizes robustness against environmental stress, making it a suitable choice for various demanding applications.
Overall, H26M52208FPR combines capacity, efficiency, and performance, catering to the growing needs of modern digital storage solutions.

Features

The H26M52208FPR is a DRAM memory chip designed for high-performance applications. Key features include:
1. Type: It is a 2Gb DDR3 SDRAM, suitable for various electronic devices.
2. Architecture: It employs a 4-bank architecture, enhancing data throughput and efficiency.
3. Speed: The chip supports data rates up to 1600 MT/s, ensuring fast data access.
4. Voltage: Operates at a low voltage of 1.5V, contributing to energy efficiency.
5. Package: Typically comes in a FBGA (Fine Ball Grid Array) package, which facilitates compact designs.
6. Access Times: Offers competitive access and cycle times, improving overall system performance.
7. Density: With a density of 2Gb, it is suitable for applications requiring substantial memory capacity but within compact form factors.
Overall, the H26M52208FPR is designed for applications in computing, networking, and consumer electronics, balancing performance, power efficiency, and size.

Package

The H26M52208FPR is packaged in a TSOP-48 (Thin Small Outline Package) format. This type of package is commonly used for memory devices, providing a compact design suitable for surface mounting on PCBs.

Pinout

The H26M52208FPR is a NAND flash memory chip with a pin count of 48. This device is designed for high-performance data storage applications and is commonly used in consumer electronics, such as smartphones and tablets. The key functions of the H26M52208FPR include data storage, read, and write operations, supporting asynchronous and synchronous access modes. It features a memory architecture that allows for efficient data management and block-level operations, which are critical for optimizing performance and endurance. The chip typically supports a variety of interfaces for communication with other components in a system, further enhancing its versatility in different applications.

Manufacturer

The manufacturer of the H26M52208FPR is Hyundai Micro Electronics. Hyundai Micro Electronics is a semiconductor company that is part of the larger Hyundai Group, which is known for its activities in various sectors, including automotive, electronics, and construction. The company specializes in memory products, including NAND flash and DRAM, and serves various industries with its integrated circuit solutions. Hyundai Micro Electronics aims to innovate and provide high-quality semiconductor products that meet the demands of the rapidly evolving technology landscape.

Application

The H26M52208FPR is a NAND flash memory chip commonly used in various applications, including consumer electronics (smartphones, tablets), industrial automation, automotive systems, and embedded systems. Its high-density storage capabilities make it suitable for data storage in devices requiring fast access and high reliability, such as solid-state drives (SSDs), gaming consoles, and digital cameras.

Equivalent

The H26M52208FPR chip is a 2Gb DDR3 SDRAM memory chip. Equivalent products include:
1. MT41K256M16HA - Micron
2. K4B4G1646E - Samsung
3. VT8G8FS8U1 - Viking Technology
Always verify compatibility with your specific application needs.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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