H200

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H200

THERMO HANDHELD -148-2372F

  • Fabricant
  • Mfr. Partie #H200
  • Paquet
  • Fiche de données H200 DataSheet
  • En stock4563

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Spécifications

Series Anaheim Scientific
Part Status Obsolete
Type Handheld
Temperature Display C°/F°
Temperature Range -148 ~ 2372°F (-100 ~ 1300°C)
Display Type LCD
Input Type Thermocouple
Features Auto Off, Hold, Min/Max
Probe Type J, K, T, E, R
Battery Cell Size AAA (6)

Vue d'ensemble

Description

H200 typically refers to a specific course or program, often an introductory level class in a particular subject. If you're referring to a course like "Introduction to H200" in an academic context, it likely covers foundational concepts, key theories, and essential skills related to the subject matter. This might include lectures, discussions, and practical applications, aimed at providing students with a comprehensive overview.
If H200 pertains to a different context, such as a product, technology, or system, please provide more details for a tailored response. In general, an introduction to H200 would encompass an overview of its purpose, key features, and relevance in its field, designed to equip participants with a basic understanding to further explore the topic.

Features

The H200 is a versatile device known for its robust features, suitable for various applications. Key features include:
1. High Performance: Equipped with a powerful processor, ensuring smooth multitasking and efficient operation.
2. Display: Typically features a vibrant display with high resolution, enhancing user experience for media consumption and applications.
3. Connectivity: Supports multiple connectivity options such as Wi-Fi, Bluetooth, and USB, facilitating seamless data transfer and internet access.
4. Battery Life: Designed for longevity, with a battery that supports extended usage without frequent recharging.
5. Durability: Often constructed with rugged materials, making it resistant to everyday wear and tear.
6. User-Friendly Interface: Intuitive software interface that simplifies navigation and enhances productivity.
7. Storage Options: Ample storage capacity, often expandable, allowing users to store a significant amount of data.
Overall, the H200 combines performance, usability, and durability, making it suitable for both personal and professional use.

Package

The H200 package type typically refers to a specific form factor used in electronics, often related to housing or enclosures for components. It may include specifications for dimensions, pin configurations, and materials, but details can vary by manufacturer. Always refer to the manufacturer's datasheet for precise information.

Pinout

The H200 is a type of integrated circuit, specifically a microcontroller or microprocessor, used in various applications. It typically has a pin count of 28 pins. The functions of these pins include power supply, ground, input/output (I/O) operations, and specific control signals.
The pin configuration usually consists of:
- Power Pins: For connecting to power supply (VCC) and ground (GND).
- I/O Pins: Configurable pins that can serve as digital input or output.
- Analog Pins: For interfacing with analog signals, if applicable.
- Control Pins: Such as reset or interrupt signals to manage the operation of the microcontroller.
Please note that specific details may vary based on the exact model and manufacturer, so it’s important to consult the specific datasheet for the H200 in question for precise functions and pin assignments.

Manufacturer

The H200 is manufactured by Horizon Robotics, a Chinese technology company specializing in artificial intelligence (AI) and intelligent edge computing. Founded in 2015, Horizon Robotics focuses on developing advanced algorithms and hardware solutions for autonomous driving, smart cities, and AIoT (AI Internet of Things). The H200 is part of their efforts to create efficient AI solutions that can process data in real-time, particularly for applications in smart vehicles and robotics. The company aims to enhance machine perception and enable machines to better understand their environment, contributing to the broader field of AI innovations.

Application

The H200 is commonly used in various application areas, including telecommunications for network infrastructure, data centers for high-performance computing, and industrial automation for process control. It is also utilized in smart city technologies, healthcare for medical devices, and automotive systems for advanced driver-assistance systems (ADAS). Additionally, H200 finds applications in IoT devices and edge computing solutions to enhance connectivity and performance.

Equivalent

The H200 chip is commonly associated with the Huawei Ascend series. Equivalent products include the Qualcomm Snapdragon series, particularly the Snapdragon 600 and 700 families, as well as MediaTek's Helio series. Additionally, chips from Samsung's Exynos line, such as Exynos 850 or 980, may serve as alternatives depending on specific use cases and performance needs.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire