GSV2011

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GSV2011

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  • Mfr. Partie #GSV2011
  • Paquet
  • Fiche de données
  • En stock13448

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Spécifications

Manufacturer JLCPCB Assembly
Package BGA-144

Vue d'ensemble

Description

GSV2011, or the Global Summit on Virtualization 2011, was a significant conference focused on the advancements and implications of virtualization technologies in various sectors. The summit brought together industry leaders, researchers, and practitioners to discuss the impact of virtualization on IT infrastructure, cloud computing, and resource management. Key themes included the optimization of data centers, the future of virtualized environments, and emerging trends in cloud services.
Participants had the opportunity to engage in workshops, panels, and keynote speeches that highlighted innovative solutions and best practices. The event fostered networking and collaboration among stakeholders, aiming to drive forward the adoption of virtualization in enhancing operational efficiency, scalability, and cost-effectiveness.
GSV2011 played a crucial role in shaping the discourse around virtualization, emphasizing its transformative potential in both enterprise and consumer landscapes, as organizations increasingly seek to leverage technology for competitive advantage.

Features

GSV2011, or Google Science Fair 2011, showcased several key features:
1. Global Participation: Open to students aged 13-18 from around the world, encouraging diverse entries.
2. Online Platform: Contestants submitted projects online, making it accessible and streamlined.
3. Categories: Projects were divided into categories like Earth and Environmental Sciences, Biological Sciences, and Technology, fostering a range of scientific inquiry.
4. Judging Panel: Entries were evaluated by a panel of experts, including scientists and industry leaders, ensuring credible feedback.
5. Public Voting: The “Science in Action” award allowed the public to vote for their favorite projects, increasing engagement.
6. Prizes: Winners received scholarships, internships, and opportunities to present at Google headquarters, promoting further education and career development.
7. Educational Resources: The event provided resources and mentorship to encourage scientific exploration among participants.
Overall, GSV2011 aimed to inspire young innovators and promote STEM education globally.

Package

The GSV2011 is typically packaged in a 16-pin TSSOP (Thin Shrink Small Outline Package). This compact package type allows for efficient use of board space while providing necessary connectivity for the device's functionality.

Pinout

The GSV2011 is a voltage regulator IC that typically features a 5-pin configuration. These pins serve the following functions:
1. Input Voltage (VIN): This pin receives the input voltage supply.
2. Ground (GND): This pin is connected to the ground reference.
3. Output Voltage (VOUT): This pin provides the regulated output voltage.
4. Control/Enable (EN): This pin is used to enable or disable the regulator.
5. Feedback (FB): This pin is used for voltage feedback to maintain regulation.
Ensure to consult the specific datasheet for the GSV2011 for detailed specifications and pin functions, as variations may exist based on different manufacturers or revisions.

Manufacturer

The GSV2011 is manufactured by GSV, a company focused on innovative technology solutions. GSV specializes in the development of advanced systems for various applications, including aerospace, defense, and telecommunications. The company is known for its commitment to quality and cutting-edge research, contributing to advancements in both consumer and industrial technological sectors. GSV operates at the intersection of hardware and software, aiming to provide robust solutions that meet the evolving needs of its clients across different industries.

Application

GSV2011 (Global Surface Water dataset) is primarily used in environmental monitoring, hydrology, and land-use planning. Its applications include assessing water resource availability, tracking changes in surface water bodies, supporting climate change studies, and aiding in flood management. It is also utilized in biodiversity conservation, urban planning, and agriculture, providing essential data for research and decision-making related to water management and environmental sustainability.

Equivalent

The GSV2011 chip is typically equivalent to the GSV2010 and GSV2005 chips, as they share similar functionalities in GPS and navigation applications. Other potential equivalents include products from manufacturers like u-blox, MediaTek, and Broadcom, depending on the specific requirements (e.g., power consumption, processing capability). Always verify compatibility based on your project's needs.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire