GD25LE128DLIGR

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GD25LE128DLIGR

IC FLSH 128MBIT SPI/QUAD 21WLCSP

  • Fabricant
  • Mfr. Partie #GD25LE128DLIGR
  • Paquet 21-XFBGA, WLSCP
  • Fiche de données
  • En stock3634

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Spécifications

Package Tape & Reel (TR)
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NOR
MemorySize 128Mb (16M x 8)
MemoryInterface SPI - Quad I/O
ClockFrequency 120 MHz
WriteCycleTime-WordPage 2.4ms
Voltage-Supply 1.65V ~ 2V
OperatingTemperature -40°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 21-XFBGA, WLSCP

Vue d'ensemble

Description

The GD25LE128DLIGR is a 128Mb (16MB) serial NOR flash memory chip produced by GigaDevice. It features a dual and quad SPI interface, making it suitable for high-speed data transfer. Designed for embedded applications, it operates on a voltage range of 2.7V to 3.6V and supports various features, including Read, Program, and Erase operations. The device offers a fast read speed up to 104 MHz and supports multiple programming modes, including Page Program and Sector Erase.
The memory is organized into 256 sectors of 64KB each, allowing for efficient data management and storage. Its compact 8-pin SOIC package facilitates easy integration into a range of electronic devices, such as microcontrollers, consumer electronics, and automotive systems. The GD25LE128DLIGR also includes protection features like hardware write protection and a software protection mechanism, enhancing data security. Overall, it is a versatile and reliable option for applications requiring non-volatile storage.

Features

The GD25LE128DLIGR is a 128Mb (16MB) serial NOR flash memory chip from GigaDevice, featuring the following key attributes:
1. Interface: Supports SPI (Serial Peripheral Interface), enabling fast data transfer rates.
2. Voltage Range: Operates within a supply voltage of 2.7V to 3.6V, making it suitable for various applications.
3. Density: Offers 128Mb capacity, ideal for storing firmware, configurations, or boot code.
4. Read Speed: Achieves high read speeds, up to 104 MHz in dual and quad modes.
5. Programming: Supports byte, page, and sector programming, facilitating flexible data management.
6. Erase Cycles: Endurance of 100,000 program/erase cycles per sector.
7. Data Retention: Retains data for over 20 years at 85°C.
8. Package Options: Available in various packages, including 8-pin SOIC and 16-pin WSON, catering to different design requirements.
9. Applications: Commonly used in consumer electronics, automotive, and IoT devices.
This combination of features makes the GD25LE128DLIGR a versatile choice for embedded memory solutions.

Package

The GD25LE128DLIGR is packaged in a SOP-8 (Small Outline Package) form factor. This package type features eight pins and is commonly used for surface mount applications in electronic devices.

Pinout

The GD25LE128DLIGR is a 128Mb (16MB) Serial NOR Flash memory chip that typically features a 16-pin SOIC (Small Outline Integrated Circuit) package.
Pin Count: 16 pins
Pin Functions:
1. 1 (CS) - Chip Select
2. 2 (SO) - Serial Output
3. 3 (VSS) - Ground
4. 4 (WP) - Write Protect
5. 5 (HOLD) - Hold
6. 6 (SI) - Serial Input
7. 7 (SCK) - Serial Clock
8. 8 (VCC) - Power Supply (typically 2.7V to 3.6V)
9. 9-16 - Not used (may be NC or reserved for other functions depending on package and configuration)
This device is designed for applications requiring non-volatile memory with fast read speeds and low power consumption.

Manufacturer

The GD25LE128DLIGR is manufactured by GigaDevice Semiconductor Inc., a company headquartered in Beijing, China. GigaDevice specializes in the design and production of non-volatile memory solutions, including flash memory, EEPROM, and microcontrollers. The company is known for its focus on high-performance memory products and has established itself as a significant player in the semiconductor industry, catering to various applications, including consumer electronics, automotive, and industrial sectors. GigaDevice emphasizes innovation and quality in its offerings, aiming to meet the growing demand for memory solutions in advanced technology markets.

Application

The GD25LE128DLIGR is a 128Mb (16MB) SPI Flash memory chip typically used in applications like firmware storage, data logging, code execution, and system booting for embedded systems, consumer electronics, automotive electronics, IoT devices, and industrial control systems. Its fast read speeds and low power consumption make it suitable for applications requiring quick data access and efficient power usage.

Equivalent

The GD25LE128DLIGR chip, a 128 Mb serial NOR Flash memory, has several equivalent products, including:
1. Winbond W25Q128JV
2. Micron MT25QL128ABA
3. Spansion S25FL128S
4. Cypress S25FL128SAG
These alternatives may have slight variations in specifications, so ensure compatibility with your specific application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

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