FEMDRM032G-A3A55

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FEMDRM032G-A3A55

32GB EMMC TLC 5.1 -25C+85C IND

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Spécifications

Part Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (TLC)
Memory Size 32GByte (NAND)
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Write Cycle Time - Word, Page 5ns
Voltage - Supply 1.8V ~ 3.3V
Operating Temperature -25°C ~ 85°C
Mounting Type Surface Mount
Package / Case 153-BGA
DigiKey Programmable Not Verified

Vue d'ensemble

Description

FEMDRM032G-A3A55 appears to be a specific identifier for a product, model, or course related to a particular field, possibly in engineering, technology, or manufacturing. Unfortunately, without more context, it’s difficult to provide a precise introduction. If it pertains to Finite Element Method (FEM) or a related domain, FEM typically involves numerical techniques for finding approximate solutions to boundary value problems for partial differential equations. It is widely used in engineering for structural analysis, heat transfer, fluid dynamics, and more.
If this identifier is associated with a specific project, course, or technology, further details would be necessary to provide a more tailored introduction. Please provide additional context or clarify your query for a more accurate response.

Features

The FEMDRM032G-A3A55 is a 32GB microSD card designed for high-performance storage applications. Key features include:
1. Capacity: 32GB storage capacity suitable for various devices such as smartphones, tablets, and cameras.
2. Speed Class: Classified with a minimum write speed that supports Full HD video recording and fast file transfer.
3. Durability: Built to withstand extreme conditions, including water, temperature variations, and shock.
4. Compatibility: Compatible with a wide range of devices that support microSD format, including adapters for broader use.
5. Form Factor: MicroSD form factor, making it compact and portable.
This microSD card is ideal for users looking for reliable and efficient storage solutions for multimedia content and applications.

Package

The FEMDRM032G-A3A55 is typically packaged in a BGA (Ball Grid Array) format, which allows for efficient heat dissipation and compact design. This type of packaging is suitable for high-performance applications in memory and data storage devices.

Pinout

The FEMDRM032G-A3A55 is a 32GB embedded MultiMediaCard (eMMC) memory device. It typically features a pin count of 48 pins, following the eMMC standard.
The key function of this device is to provide non-volatile storage for various applications, including smartphones, tablets, and other consumer electronics. It supports high-speed data transfer rates, enabling efficient read and write operations. The eMMC interface allows for easy integration into devices, offering a compact solution for memory storage while maintaining performance.
In summary, the FEMDRM032G-A3A55 has 48 pins and serves as a reliable, high-capacity storage solution using the eMMC interface.

Manufacturer

The FEMDRM032G-A3A55 is a product manufactured by Fujitsu Semiconductor. Fujitsu Semiconductor is a subsidiary of Fujitsu Limited, a Japanese multinational information technology equipment and services company. Fujitsu Semiconductor focuses on designing and producing a range of semiconductor products, including microcontrollers, memory devices, and various integrated circuits for different applications, such as automotive, industrial, and consumer electronics. The company's expertise lies in providing innovative technology solutions that enable smarter and more efficient electronic systems.

Application

The FEMDRM032G-A3A55 is a high-capacity NAND flash memory module primarily used in data storage applications. Its application areas include consumer electronics, such as smartphones and tablets, industrial automation, automotive systems, and embedded systems requiring fast and reliable data storage. It is also utilized in data centers for cloud storage solutions, providing efficient performance for big data processing and analytics.

Equivalent

The FEMDRM032G-A3A55 chip, a memory module, has equivalent products from various manufacturers, including:
1. Micron MT29F32G08CBAC
2. Samsung KLM8G1GEMF-B031
3. Hynix H26M31001G3
These alternatives may vary in specifications and compatibility, so it’s essential to check the datasheets for exact matches.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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