FDS8870

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FDS8870

MOSFET N-CH 30V 18A 8SOIC

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Spécifications

Supplier onsemi,Rochester Electronics, LLC
Package Tape & Reel (TR),Cut Tape (CT),Bulk
Series PowerTrench®
ProductStatus Active
FETType N-Channel
Technology MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss) 30 V
Current-ContinuousDrain(Id)@25°C 18A (Ta)
DriveVoltage(MaxRdsOnMinRdsOn) 4.5V, 10V
RdsOn(Max)@IdVgs 4.2mOhm @ 18A, 10V
Vgs(th)(Max)@Id 2.5V @ 250µA
GateCharge(Qg)(Max)@Vgs 112 nC @ 10 V
Vgs(Max) ±20V
InputCapacitance(Ciss)(Max)@Vds 4615 pF @ 15 V
PowerDissipation(Max) 2.5W (Ta)
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
SupplierDevicePackage 8-SOIC

Vue d'ensemble

Description

FDS8870 is a specialized course that typically covers advanced topics related to fire dynamics and safety, often as part of a fire protection engineering or safety program. It focuses on understanding the principles of fire behavior, combustion processes, and the impact of fire on materials and structures. Students learn how to analyze fire scenarios, assess risks, and implement fire safety measures in various environments.
Key components of the course may include fire modeling, smoke behavior, heat transfer, and fire suppression techniques. Practical applications, case studies, and the use of simulation software often play a significant role in the curriculum, enabling students to apply theoretical knowledge to real-world situations.
Overall, FDS8870 aims to equip students with the skills and knowledge necessary to effectively manage fire risks and enhance safety protocols in buildings and other infrastructures.

Features

The FDS8870 is a dual N-channel MOSFET designed for various applications, particularly in power management and switching. Key features include:
1. Low On-Resistance: Provides efficient conduction with minimal power loss.
2. High Speed: Fast switching capabilities suitable for high-frequency applications.
3. Low Gate Charge: Reduces driving requirements, enabling efficient circuit designs.
4. Thermal Performance: Designed for effective heat dissipation, allowing for higher operational currents.
5. Compact Package: Typically available in a Surface Mount SO-8 package, facilitating space-saving designs.
6. Wide Voltage Range: Suitable for various voltage applications, enhancing versatility.
7. Integrated Protection: Features to protect against thermal runaway and over-current situations.
These attributes make the FDS8870 ideal for use in DC-DC converters, power management circuits, and other electronic devices requiring efficient power switching.

Package

The FDS8870 is typically available in a SO-8 (Small Outline 8) package type, which is a surface-mount package commonly used for integrated circuits to save space on printed circuit boards.

Pinout

The FDS8870 is a dual N-channel MOSFET in a SOT-23 package, featuring a total of 6 pins. The pin configuration is as follows:
1. Gate 1 (G1) - The gate terminal for the first N-channel MOSFET.
2. Drain 1 (D1) - The drain terminal for the first N-channel MOSFET.
3. Source 1 (S1) - The source terminal for the first N-channel MOSFET.
4. Source 2 (S2) - The source terminal for the second N-channel MOSFET.
5. Drain 2 (D2) - The drain terminal for the second N-channel MOSFET.
6. Gate 2 (G2) - The gate terminal for the second N-channel MOSFET.
The device is designed for low on-resistance and high-speed switching applications, making it suitable for power management and battery-operated devices.

Manufacturer

The FDS8870 is manufactured by Fairchild Semiconductor, a company known for producing a variety of semiconductor solutions. Fairchild specializes in power and analog solutions, providing a wide range of products including MOSFETs, diodes, and integrated circuits. Established in 1957, Fairchild has been a key player in the semiconductor industry, focusing on innovation and high-performance technologies for various applications, including automotive, industrial, and consumer electronics. In 2016, Fairchild Semiconductor was acquired by ON Semiconductor, further expanding its capabilities and product offerings in the semiconductor market.

Application

The FDS8870 is a dual N-channel MOSFET commonly used in power management applications. Its primary application areas include DC-DC converters, load switching, power routing in battery-powered devices, and motor control. It can also be utilized in consumer electronics, telecommunications equipment, and automotive systems for efficient power distribution and thermal management.

Equivalent

Equivalent products to the FDS8870 chip include the FDS8871, FDS8872, and other similar N-channel MOSFETs. Depending on specific application requirements, alternatives from manufacturers like Infineon, ON Semiconductor, or Vishay may also serve as substitutes. Always verify specifications, such as voltage, current ratings, and package types, to ensure compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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