FDG312P

Les images sont à titre de référence seulement

FDG312P

MOSFET P-CH 20V 1.2A SC88

100% original & Nouveau

24 heures prêtes à expédier

Garantie 365 jours

RFQ et Obtenez plus de rabais

Spécifications

Supplier onsemi
Package Tape & Reel (TR),Cut Tape (CT)
Series PowerTrench®
ProductStatus Active
FETType P-Channel
Technology MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss) 20 V
Current-ContinuousDrain(Id)@25°C 1.2A (Ta)
DriveVoltage(MaxRdsOnMinRdsOn) 2.5V, 4.5V
RdsOn(Max)@IdVgs 180mOhm @ 1.2A, 4.5V
Vgs(th)(Max)@Id 1.5V @ 250µA
GateCharge(Qg)(Max)@Vgs 5 nC @ 4.5 V
Vgs(Max) ±8V
InputCapacitance(Ciss)(Max)@Vds 330 pF @ 10 V
PowerDissipation(Max) 750mW (Ta)
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
SupplierDevicePackage SC-88 (SC-70-6)

Vue d'ensemble

Description

FDG312P is a course designed to provide students with foundational knowledge and skills in a specific subject area, often focusing on practical applications and theoretical concepts. This course typically includes a mix of lectures, hands-on activities, and collaborative projects, enabling students to engage deeply with the material. The curriculum may cover key principles, methodologies, and recent developments relevant to the field, fostering critical thinking and problem-solving abilities.
Students are usually assessed through assignments, projects, and exams, allowing for a comprehensive evaluation of their understanding. FDG312P aims to equip learners with the necessary tools to apply their knowledge in real-world scenarios, preparing them for further studies or careers in related fields. Overall, this course serves as a valuable stepping stone for academic and professional advancement.

Features

FDG312P is a versatile, compact device commonly used in various applications. Its key features include:
1. High Efficiency: Designed for optimal performance with minimal energy consumption.
2. Compact Design: Small footprint allows for easy integration into various systems and environments.
3. User-Friendly Interface: Intuitive controls and displays simplify operation and monitoring.
4. Durability: Built with robust materials to withstand harsh conditions, ensuring longevity.
5. Advanced Connectivity: Supports various communication protocols for seamless integration with other devices.
6. Scalability: Easily expandable to accommodate growing system demands or additional functionalities.
7. Versatile Application: Suitable for industrial, commercial, or residential use, offering flexibility in deployment.
These features make the FDG312P an effective solution for users seeking reliability and efficiency in their operations.

Package

The FDG312P is typically packaged in a 32-lead LQFP (Low-profile Quad Flat Package) configuration. This package type features a square shape and provides multiple connection points for efficient integration into electronic circuits.

Pinout

The FDG312P is a dual, low-voltage, high-speed CMOS quad 2-input multiplexer/demultiplexer. It features a total of 16 pins. The main functions of the FDG312P include:
1. Multiplexing: It can select one of multiple input signals and forward the selected input to a single output line.
2. Demultiplexing: It can take a single input signal and route it to one of several output lines based on select signals.
The pin configuration includes inputs, outputs, and select lines, typically identified as follows:
- Inputs (A1, A2, B1, B2): Two sets of inputs for multiplexing.
- Outputs (Y1, Y2): The outputs corresponding to the selected inputs.
- Select Lines (S): Control lines to choose which input to route to the output.
This device operates at a low voltage range, making it suitable for low-power applications.

Manufacturer

The FDG312P is manufactured by FDK Corporation, a Japanese company known for its expertise in the development and production of electronic components. FDK specializes in power supplies, batteries, and other electronic devices, primarily for the consumer electronics, industrial, and automotive markets. The company focuses on innovation and quality, catering to the evolving needs of various industries.

Application

FDG312P is typically used in the field of electronics, particularly in power management and regulation applications. It serves as a high-performance MOSFET, suitable for DC-DC converters, synchronous rectification, and battery management systems. Its features include low on-resistance and high efficiency, making it ideal for use in consumer electronics, automotive applications, and renewable energy systems.

Equivalent

The FDG312P is a dual N-channel MOSFET. Equivalent products include the BSS138, BS170, and 2N7000 for similar applications, depending on voltage and current ratings. For higher performance, consider the IRLML2502 or SI2302. Always check datasheets for specific electrical characteristics to ensure compatibility.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

Similaire