FDC2612

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FDC2612

MOSFET N-CH 200V 1.1A SUPERSOT6

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Spécifications

Package Tape & Reel (TR),Cut Tape (CT)
Series PowerTrench®
ProductStatus Active
FETType N-Channel
Technology MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss) 200 V
Current-ContinuousDrain(Id)@25°C 1.1A (Ta)
DriveVoltage(MaxRdsOnMinRdsOn) 10V
RdsOn(Max)@IdVgs 725mOhm @ 1.1A, 10V
Vgs(th)(Max)@Id 4.5V @ 250µA
GateCharge(Qg)(Max)@Vgs 11 nC @ 10 V
Vgs(Max) ±20V
InputCapacitance(Ciss)(Max)@Vds 234 pF @ 100 V
PowerDissipation(Max) 1.6W (Ta)
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
SupplierDevicePackage SuperSOT™-6

Vue d'ensemble

Description

FDC2612 is a high-performance, dual-channel, digital-to-analog converter (DAC) designed for precision applications. It features a 12-bit resolution, which allows for fine control over output voltage levels. This DAC integrates with a range of microcontrollers and digital signal processors via a simple serial interface, typically using SPI (Serial Peripheral Interface) protocol.
Key features include low differential nonlinearity (DNL) and integral nonlinearity (INL), ensuring accurate signal representation. It also offers programmable output ranges and a fast settling time, making it suitable for applications in signal generation, audio processing, and instrumentation.
The FDC2612 is commonly used in industrial, automotive, and consumer electronics, leveraging its ability to produce high-quality analog signals from digital sources. Additionally, its small form factor and low power consumption make it ideal for embedded systems and portable devices. Overall, the FDC2612 combines precision, versatility, and efficiency, making it a valuable component in modern electronic designs.

Features

The FDC2612 is a high-performance, dual-channel digital-to-analog converter (DAC) designed for precise, low-noise applications. Key features include:
1. Dual-Channel Operation: Offers two independent DAC outputs for versatile applications.
2. High Resolution: Typically provides 12-bit resolution, ensuring accurate signal representation.
3. Fast Update Rate: Capable of achieving fast output updates, which is essential for dynamic applications.
4. Low Power Consumption: Designed for energy efficiency, making it suitable for battery-operated devices.
5. Integrated Reference: Includes an internal voltage reference, simplifying system design and enhancing performance.
6. Flexible Interface: Supports multiple communication protocols (e.g., I2C/SPI), facilitating easy integration into various systems.
7. Temperature Stability: Features thermal compensation for consistent performance across a wide temperature range.
The FDC2612 is ideal for applications in industrial automation, data acquisition, and telecommunications, where precision and reliability are critical.

Package

The FDC2612 is typically available in a 32-pin LQFP (Low-Profile Quad Flat Package) form factor. This package type is designed for surface mounting and offers a compact footprint suitable for various applications.

Pinout

The FDC2612 is a capacitive sensor interface IC used for touch sensing applications. It features a pin count of 16 pins.
The main functions of the pins are as follows:
1. VDD: Power supply input.
2. GND: Ground reference.
3. SCK: SPI clock input for communication.
4. MOSI: Master Out Slave In, for SPI data input.
5. MISO: Master In Slave Out, for SPI data output.
6. CS: Chip select for SPI communication.
7. IRQ: Interrupt request output.
8. CAP: Input for capacitive sensor electrodes.
9. REF: Reference voltage input for the sensor.
10. N/C: Not connected, reserved for future use or optional functions.
Other pins may be used for additional functionalities or configurations, such as enabling specific settings. The FDC2612 is designed for high-resolution and noise-immune capacitive sensing applications.

Manufacturer

The FDC2612 is manufactured by Texas Instruments (TI), a multinational semiconductor company based in the United States. Texas Instruments is known for designing and producing a wide range of electronic components, including analog, digital signal processing (DSP), and embedded processing technologies. The company serves various industries, including automotive, industrial, communications, and consumer electronics, providing innovative solutions that enable the development of advanced electronic systems. TI is recognized for its commitment to research and development, contributing significantly to the advancement of semiconductor technology.

Application

The FDC2612 is widely used in applications such as capacitive sensing, touch sensing, and liquid level measurement. It is suitable for industrial automation, consumer electronics, automotive systems, and medical devices, where accurate capacitance measurement is essential. Additionally, it can be utilized in proximity sensors and environmental monitoring systems for detecting changes in capacitance due to external factors.

Equivalent

The FDC2612 chip, a frequency-to-digital converter, has several equivalent products including the FDC2214, FDC2212, and FDC2216 from Texas Instruments. Other alternatives may include the ADPD188GI from Analog Devices and the LTC5546 from Analog Devices, depending on specific application requirements. Always check datasheets for compatibility and features.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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