F50D1G41LB-83YIG2M

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F50D1G41LB-83YIG2M

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  • Mfr. Partie #F50D1G41LB-83YIG2M
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Spécifications

Manufacturer ESMT(Elite Semicon Memory Tech)
Package WSON-8_8X6

Vue d'ensemble

Description

The F50D1G41LB-83YIG2M is a type of memory device, specifically a DRAM (Dynamic Random Access Memory) component. It is designed to provide high-speed data storage and retrieval for various electronic applications, including computing and mobile devices. The part number suggests specifications such as capacity (1Gbit), type (DDR4), and features like low power consumption and high performance, which are typical for modern memory solutions.
This component is commonly used in smartphones, tablets, and laptops, enabling efficient multitasking and improved performance in handling applications. The “-83YIG2M” part likely denotes specific variations in operating speed, voltage, or packaging type. When integrating this memory into a system, considerations such as compatibility with the motherboard and power supply requirements are essential for optimal performance. As technology advances, devices like the F50D1G41LB-83YIG2M continue to evolve, offering greater speed and efficiency in data processing.

Features

The F50D1G41LB-83YIG2M is a 1Gbit (Gigabit) DDR3 SDRAM memory chip. Key features include:
1. Density: 1 Gigabit capacity, suitable for high-performance applications.
2. Data Rate: Operates at DDR3 standards, supporting data rates of up to 1600 MT/s (Mega Transfers per second).
3. Voltage: Typically operates at a low voltage of 1.5V, enhancing energy efficiency.
4. Package Type: Usually comes in a compact FBGA (Fine Ball Grid Array) package, facilitating space-efficient designs.
5. Access Speed: Offers fast access times, improving overall system performance.
6. Interface: Utilizes a standard DDR3 interface for compatibility with a wide range of devices.
7. Applications: Commonly used in computing, networking, and consumer electronics, including laptops and desktops.
These features make the F50D1G41LB-83YIG2M ideal for applications requiring reliable and efficient memory solutions.

Package

The F50D1G41LB-83YIG2M is packaged in a TFBGA (Thin Fine Ball Grid Array) format. This compact package type is designed for efficient space utilization on PCBs and provides good thermal performance and electrical connectivity.

Pinout

The F50D1G41LB-83YIG2M is a 1Gbit DDR3 SDRAM memory chip. It has a pin count of 78 pins in a TSOPII (Thin Small Outline Package) configuration.
The primary function of this chip is to provide high-speed memory for various applications, including computing devices and embedded systems. It operates at a voltage of 1.5V and is designed for data rates of up to 1600 MT/s. The chip follows the DDR3 standard, which enables efficient data transfer and improved performance compared to previous DDR generations.
Key functions include data storage, address input, and control signals for read/write operations, making it suitable for dynamic memory applications.

Manufacturer

The manufacturer of the F50D1G41LB-83YIG2M is Fujitsu Semiconductor Limited, a subsidiary of Fujitsu Limited. Fujitsu Semiconductor specializes in the design, development, and manufacturing of semiconductor products, including microcontrollers, memory chips, and application-specific integrated circuits (ASICs). The company serves various industries, such as automotive, consumer electronics, and telecommunications, providing innovative solutions for embedded systems and advanced computing applications. Fujitsu is known for its commitment to quality and technological advancement, making it a significant player in the semiconductor industry.

Application

The F50D1G41LB-83YIG2M is a high-performance CMOS analog-to-digital converter (ADC) used in various applications, including industrial automation, medical devices, automotive systems, and consumer electronics. It is suitable for data acquisition systems, sensor interfacing, and real-time monitoring due to its precision and speed.

Equivalent

The F50D1G41LB-83YIG2M chip is a 1 Gb DDR3 SDRAM memory device. Equivalent products may include other 1 Gb DDR3 SDRAM chips from various manufacturers, such as the Micron MT41J1G4, Samsung K4B4G1646D, and Hynix H5TQ1G83EFR. Always verify compatibility with specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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