EP3C25F324I7

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EP3C25F324I7

IC FPGA 215 I/O 324FBGA

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  • Mfr. Partie #EP3C25F324I7
  • Paquet
  • Fiche de données
  • En stock9278

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Spécifications

Series Cyclone® III
Part Status Active
DigiKey Programmable Not Verified
Total RAM Bits 608256
Number of I/O 215
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 324-BGA
Supplier Device Package 324-FBGA (19x19)
Base Product Number EP3C25
Number of Logic Elements/Cells 24624
Number of LABs/CLBs 1539

Vue d'ensemble

Description

The EP3C25F324I7 is a part of the Intel (formerly Altera) Cyclone III FPGA family, designed for low-cost, low-power applications. It features a logic capacity of approximately 25,000 logic elements, making it suitable for a variety of digital logic applications, including communications, automotive, and industrial control systems.
Key specifications include a maximum operating frequency of around 200 MHz, support for multiple I/O standards, and a range of configurable I/O pins. The FPGA supports various design methodologies, including hardware description languages like VHDL and Verilog, allowing for flexible design implementations.
The EP3C25F324I7 also offers built-in memory resources, including RAM blocks, and is compatible with various development tools and intellectual property (IP) cores. The device is packaged in a 324-pin fine-pitch ball grid array (FBGA) for efficient thermal and electrical performance. Overall, it is a versatile choice for engineers looking for a balance of performance and cost in FPGA solutions.

Features

The EP3C25F324I7 is a member of Intel's Cyclone III FPGA family, designed for low-cost, low-power applications. Here are its main features:
1. Logic Elements: It contains approximately 25,000 logic elements, supporting a range of complex designs.
2. Memory: Features up to 1.5 Mbits of embedded memory, including support for various data storage configurations.
3. I/O Pins: Offers up to 324 user I/O pins, allowing flexible interfacing with other components.
4. Performance: Capable of operating at high frequencies (up to 200 MHz) for efficient processing.
5. Power Efficiency: Designed to consume low power, making it suitable for battery-powered and thermal-sensitive applications.
6. Configuration: Supports multiple configuration schemes, including JTAG and passive serial, enhancing design flexibility.
7. Development Support: Compatible with Intel Quartus Prime software for easier design implementation and debugging.
These features make the EP3C25F324I7 ideal for applications in telecommunications, automotive, and consumer electronics.

Package

The EP3C25F324I7 is packaged in a 324-pin F324 Fine Pitch Ball Grid Array (FBGA) format.

Pinout

The EP3C25F324I7 is a Cyclone III FPGA from Intel (formerly Altera) and features 324 pins. This specific device belongs to the Cyclone III family, which offers a balance of performance, power efficiency, and cost.
The main functions of the EP3C25F324I7 include:
1. Configurable Logic Blocks (CLBs): Used for implementing custom logic functions.
2. Memory Elements: Includes embedded memory blocks for data storage.
3. I/O Pins: Supports various I/O standards for interfacing with other devices.
4. DSP Blocks: Optimized for digital signal processing applications.
5. Clock Management: Features PLLs (Phase-Locked Loops) for clock generation and management.
The device is suitable for applications such as telecommunications, automotive, and industrial control systems, where flexibility and performance are crucial.

Manufacturer

The EP3C25F324I7 is a product manufactured by Intel Corporation, specifically part of their Cyclone III FPGA (Field-Programmable Gate Array) family. Intel is a multinational corporation primarily known for designing and manufacturing semiconductor products, including microprocessors, integrated circuits, and various hardware components. In addition to its core CPU business, Intel also provides programmable solutions through its acquisition of Altera, which is the original maker of the Cyclone FPGA series before being fully integrated into Intel. The company focuses on innovation in computing technology, serving a wide range of markets including data centers, IoT, and cloud computing.

Application

The EP3C25F324I7 is a Cyclone III FPGA from Intel, primarily used in applications such as digital signal processing, telecommunications, video and image processing, industrial automation, and embedded systems. Its versatility allows for custom hardware implementations, making it suitable for prototyping, data acquisition, and control systems across various industries, including automotive, aerospace, and consumer electronics.

Equivalent

The EP3C25F324I7 chip is an Altera (now Intel) Cyclone III FPGA. Equivalent products include the Xilinx Spartan-6 series (e.g., XC6SLX25) and Lattice ECP2 series (e.g., LFE2-25). Other alternatives might involve more recent FPGA families from Intel or Xilinx, depending on the specific requirements for resources, power consumption, and performance. Always verify specifications for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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