EP2AGX65DF29I3G

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EP2AGX65DF29I3G

IC FPGA 364 I/O 780FBGA

  • Fabricant
  • Mfr. Partie #EP2AGX65DF29I3G
  • Paquet FBGA-780
  • Fiche de données
  • En stock4686

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Spécifications

Package Tray
Series Arria II GX
ProductStatus Active
NumberofLABs/CLBs 2530
NumberofLogicElements/Cells 60214
TotalRAMBits 5371904
NumberofI/O 364
Voltage-Supply 0.87V ~ 0.93V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 780-BBGA, FCBGA

Vue d'ensemble

Description

The EP2AGX65DF29I3G is a member of the Intel Agilex 2 FPGA family, designed for high-performance applications. It features a mid-range density and is optimized for diverse workloads, including data center, communications, and automotive systems.
Key specifications include:
- Logic Elements: Approximately 65,000 adaptive logic elements (LEs), enabling complex logic operations.
- Memory: Supports embedded memory blocks and high-speed memory interfaces.
- Processing: Offers high-speed DSP (Digital Signal Processing) capabilities, making it suitable for signal processing applications.
- I/O Flexibility: Provides a range of I/O standards and high-speed transceivers, suitable for various connectivity options.
- Power Efficiency: Designed for lower power consumption while delivering high performance.
The EP2AGX65DF29I3G is ideal for applications demanding high throughput, low latency, and adaptability, making it a versatile choice for engineers looking to implement custom hardware solutions.

Features

The EP2AGX65DF29I3G is a member of the Intel Agilex FPGA family. Key features include:
1. Architecture: Utilizes a 2D mesh architecture for high performance and efficiency.
2. Logic Elements: Contains up to 65,000 logic elements (LEs) for complex design implementations.
3. Memory: Integrated with various on-chip memory options, including M10K memory blocks.
4. DSP Blocks: Features high-performance DSP blocks optimized for signal processing applications.
5. I/O Support: Supports a wide range of I/O standards, enabling versatility in interfacing with different systems.
6. Power Management: Advanced power management features for optimized energy consumption.
7. High-Speed Transceivers: Includes high-speed transceivers for data communication.
8. Development: Supported by Intel’s software tools for design and programming, facilitating efficient development.
This FPGA is suitable for applications in data centers, communications, and industrial automation, where flexibility and performance are crucial.

Package

The EP2AGX65DF29I3G is packaged in a Fine-Pitch Ball Grid Array (FBGA) format. This package type features a grid of solder balls on the underside for surface mounting, providing a compact design suitable for high-density applications.

Pinout

The EP2AGX65DF29I3G is an FPGA (Field Programmable Gate Array) from Intel's Arria II GX family. It features a total of 256 pins. The device is designed for high-performance applications and includes various I/O options, supporting LVDS, CMOS, and other signaling standards.
The primary functions of the pins include power supply, ground, configuration, and general-purpose I/O. It also supports dedicated pins for user-defined functions, clock inputs, and JTAG for programming and debugging. The pin configuration allows flexibility in designing digital circuits for various applications, including communications, automotive, and industrial systems. Overall, the EP2AGX65DF29I3G provides a versatile platform for custom digital logic implementations.

Manufacturer

The EP2AGX65DF29I3G is manufactured by Intel Corporation. Intel is a multinational technology company based in the United States, primarily known for its semiconductor products, including microprocessors, chipsets, and programmable logic devices. The EP2AGX65DF29I3G is a part of Intel's Arria II FPGA family, which are field-programmable gate arrays used in various applications such as digital signal processing, communications, and embedded systems. Intel is recognized as a leader in the semiconductor industry, focusing on innovation in computing technologies and solutions for both consumer and enterprise markets.

Application

The EP2AGX65DF29I3G is a versatile FPGA (Field Programmable Gate Array) used in various application areas, including digital signal processing, embedded systems, telecommunications, aerospace and defense, industrial automation, and automotive systems. Its capabilities enable real-time data processing, custom hardware acceleration, and complex algorithm implementation, making it suitable for applications like video processing, machine learning, and high-speed communications.

Equivalent

The EP2AGX65DF29I3G chip is an Intel/Altera Arria II GX FPGA. Equivalent products include:
1. Xilinx Artix-7 series
2. Lattice ECP5 series
3. Microsemi SmartFusion2
These alternatives offer similar performance and functionality for applications in digital signal processing and communication. Always verify specific requirements and compatibility for your project.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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