EP2AGX260EF29I3N

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EP2AGX260EF29I3N

IC FPGA 372 I/O 780FBGA

  • Fabricant
  • Mfr. Partie #EP2AGX260EF29I3N
  • Paquet FBGA-780
  • Fiche de données
  • En stock7981

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Spécifications

Package Tray
Series Arria II GX
ProductStatus Obsolete
NumberofLABs/CLBs 10260
NumberofLogicElements/Cells 244188
TotalRAMBits 12038144
NumberofI/O 372
Voltage-Supply 0.87V ~ 0.93V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 780-BBGA, FCBGA

Vue d'ensemble

Description

The EP2AGX260EF29I3N is a member of Intel's Agilex FPGA (Field-Programmable Gate Array) family, specifically designed for high-performance and adaptive computing applications. This device features a 260K logic element capacity, making it suitable for complex signal processing, data center applications, and machine learning tasks. The FPGA offers enhanced power efficiency, high-speed transceivers, and advanced security features, enabling it to meet the demands of modern computing environments.
Key specifications include support for various memory interfaces, high bandwidth memory (HBM) integration, and a flexible architecture that allows for easy reconfiguration. The EP2AGX260EF29I3N is ideal for applications in telecommunications, automotive systems, and industrial automation, providing a balance of performance and versatility. Additionally, it supports popular development tools and frameworks, streamlining the design process for engineers and developers.

Features

The EP2AGX260EF29I3N is a member of Intel's Arria 10 FPGA family, featuring a range of advanced capabilities. Key features include:
1. Logic Elements (LEs): Approximately 260,000 LEs for high-density designs.
2. Memory: Extensive memory resources, including up to 12.5 Mbits of embedded memory.
3. DSP Blocks: Up to 840 dedicated DSP blocks for high-performance signal processing.
4. I/O: Supports multiple I/O standards and protocols, with robust transceiver options for high-speed communications.
5. Power Efficiency: Designed for low power consumption while maintaining high performance.
6. Flexibility: Suitable for various applications, including communications, video processing, and industrial automation.
7. Development Support: Compatible with Intel's Quartus Prime development software for streamlined design processes.
This FPGA is ideal for applications requiring a balance of performance, flexibility, and efficiency.

Package

The EP2AGX260EF29I3N is packaged in a FFG (Fine Pitch Ball Grid Array) package type, specifically a 29 mm x 29 mm package with a ball pitch of 1.0 mm.

Pinout

The EP2AGX260EF29I3N is an FPGA from Intel's Arria II GX family. It features a total of 256 pins. The primary functions of these pins include:
1. I/O Pins: Used for general-purpose input/output operations.
2. Power Pins: Supply power to the FPGA.
3. Clock Pins: Accept clock signals for synchronization.
4. Configuration Pins: Used for programming and configuration purposes.
5. JTAG Pins: Support boundary scan and device programming via the JTAG interface.
The device is designed for high-performance applications and includes features for digital signal processing, serial communication, and various interfacing capabilities. For detailed specifications and pin assignments, refer to the official datasheet from Intel.

Manufacturer

The EP2AGX260EF29I3N is manufactured by Intel Corporation, a leading technology company known for designing and manufacturing semiconductor products, including microprocessors, chipsets, and FPGA (Field-Programmable Gate Array) devices. Intel is primarily recognized for its role in the computer hardware industry, where it has been a major player in developing processors for personal computers, servers, and embedded systems. In addition to its CPU and semiconductor offerings, Intel has expanded its portfolio to include programmable solutions through its acquisition of Altera, which specializes in FPGAs and related technologies. The company focuses on innovation in computing, data centers, artificial intelligence, and more, making it a key contributor to advancements in technology and electronics.

Application

The EP2AGX260EF29I3N is a high-performance FPGA from Intel (formerly Altera) used in various applications, including digital signal processing, video processing, telecommunications, automotive systems, industrial automation, and data center acceleration. Its capabilities make it suitable for tasks requiring high logic density, parallel processing, and real-time data handling.

Equivalent

The EP2AGX260EF29I3N chip is part of Intel's Stratix II FPGA family. Equivalent products include:
1. EP2AGX260EF29I3 - Same model but without the industrial-grade suffix.
2. EP2AGX260FF29I3N - Different package type (FQFP).
3. EP2AGX260EF29I3 - Same FPGA without the "N" indicating the grade.
For specific applications, consider FPGA offerings from competitors like Xilinx (Virtex series) or Lattice Semiconductor (ECP series) that match in functionality and performance.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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